Dicing die-bonding film and method of forming a cut on the dicing die-bonding film

Patent metadata

Field	Value
Publication number	US-9287217-B2
Application number	US-201414315495-A
Country	US
Kind code	B2
Filing date	Jun 26, 2014
Priority date	Dec 27, 2011
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.

First claim

What is claimed is:

1. A dicing die-bonding film, comprising:
a base film;
a pressure-sensitive adhesive layer stacked on the base film; and
a bonding layer stacked on the pressure-sensitive adhesive layer,
wherein the pressure-sensitive adhesive layer includes:
a first region overlapping with the bonding layer, and
a second region not overlapping with the bonding layer, the second region including:
a third region adjacent to the first region, and
a fourth region adjacent to the third region and having a groove formed therein.

2. The dicing die-bonding film as claimed in claim 1 , wherein a ring frame is attached to the fourth region.

3. The dicing die-bonding film as claimed in claim 1 , wherein the groove has an apex at an interface between the third region and the fourth region.

4. The dicing die-bonding film as claimed in claim 1 , wherein a distance from an end point of the groove to an end point of another groove neighboring the groove ranges from 1 mm to 15 mm.

5. The dicing die-bonding film as claimed in claim 1 , wherein:
the groove is formed by cutting the dicing die-bonding film along a line connecting first to third points placed at different locations on the pressure-sensitive adhesive layer in order of the first, third, and second points or in order of the second, third, and first points,
the first point, the second point, and a central point of the pressure-sensitive adhesive layer are non-collinear,
a distance (a) from the central point of the pressure-sensitive adhesive layer to the first point, a distance (b) from the central point of the pressure-sensitive adhesive layer to the second point, and a distance (c) from the central point of the pressure-sensitive adhesive layer to the third point satisfy relationships of c<a and c<b, and
a shape of the lines connecting the first to third points is a straight line, a curved line, a wavy line, or an undulating line.

6. The dicing die-bonding film as claimed in claim 5 , wherein the distance (a) is equal to the distance (b).

7. The dicing die-bonding film as claimed in claim 5 , wherein a distance between the first point and the second point ranges from 1 mm to 15 mm.

8. The dicing die-bonding film as claimed in claim 5 , wherein a minimal distance from the first point or the second point of the groove to a first point or second point of other groove neighboring the groove ranges from 1 mm to 15 mm.

9. The dicing die-bonding film as claimed in claim 5 , wherein a vertical distance from a straight line extending between the first point and the second point to the third point ranges from 1 mm to 10 mm.

10. The dicing die-bonding film as claimed in claim 1 , wherein the groove has a shape selected from a semicircular shape, an elliptical shape, a curved shape, a polygonal shape, or a combination thereof.

11. A dicing die-bonding film, comprising:
a base film;
a pressure-sensitive adhesive layer stacked on the base film;
a bonding layer stacked on the pressure-sensitive adhesive layer; and
a release film stacked on the bonding layer or the pressure-sensitive adhesive layer,
wherein the pressure-sensitive adhesive layer includes:
a first region overlapping with the bonding layer, and
a second region surrounding the first region without overlapping with the bonding layer, and

wherein at least one groove is formed through the base film and the second region.

12. The dicing die-bonding film as claimed in claim 11 , wherein the groove does not penetrate the release film.

13. The dicing die-bonding film as claimed in claim 11 , wherein a ring frame is attached to a section inside the second region.

14. The dicing die-bonding film as claimed in claim 11 , wherein a distance from an end point of the groove to an end point of another groove neighboring the groove ranges from 1 mm to 15 mm.

15. The dicing die-bonding film as claimed in claim 11 , wherein:
the groove is formed by cutting the dicing die-bonding film along a line connecting first to third points placed at different locations on the pressure-sensitive adhesive layer in order of the first, third, and second points or in order of the second, third, and first points,
the first point, the second point, and a central point of the pressure-sensitive adhesive layer are non-collinear,
a distance (a) from the central point of the pressure-sensitive adhesive layer to the first point, a distance (b) from the central point of the pressure-sensitive adhesive layer to the second point, and a distance (c) from the central point of the pressure-sensitive adhesive layer to the third point satisfy relationships of c<a and c<b and
a shape of the lines connecting the first to third points is a straight line, a curved line, a wavy line or an undulating line.

16. The dicing die-bonding film as claimed in claim 15 , wherein the distance (a) is equal to the distance (b).

17. The dicing die-bonding film as claimed in claim 15 , wherein a distance between the first point and the second point ranges from 1 mm to 15 mm.

18. The dicing die-bonding film as claimed in claim 15 , wherein a minimal distance from the first point or the second point of the groove to first point or second point of another groove neighboring the groove ranges from 1 mm to 15 mm.

19. The dicing die-bonding film as claimed in claim 15 , wherein a vertical distance from a straight line extending between the first point and the second point to the third point ranges from 1 mm to 10 mm.

20. The dicing die-bonding film as claimed in claim 11 , wherein the groove has a shape selected from a semicircular shape, an elliptical shape, a curved shape, a polygonal shape, or a combination thereof.

21. A method of forming a groove in a dicing die-bonding film that includes a base film; a pressure-sensitive adhesive layer stacked on the base film; a bonding layer stacked on a central part of the pressure-sensitive adhesive layer; and a release film stacked on the bonding layer or the pressure-sensitive adhesive layer, the method comprising:
inserting a knife blade into the dicing die-bonding film from the base film to a depth penetrating a region of the pressure-sensitive adhesive layer, on which the bonding layer is not stacked, without penetrating the release film.

Assignees

• Park Baek Soung
• Choi Jae Won
• Kim Sung Min
• Kim In Hwan
• Lee Jun Woo
• Im Su Ml
• Cheil Ind Inc

Inventors

• Park Baek Soung
• Choi Jae Won
• Kim Sung Min
• Kim In Hwan
• Lee Jun Woo
• Im Su Ml

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10D84/01

  Manufacture or treatment · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/013

  of die-attach connectors · CPC title