Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch
US-2016365283-A1 · Dec 15, 2016 · US
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Eaton Brad patents in 2016
Eaton Brad was listed as an assignee on 17 patent publications in 2016.
| Metric | Value |
|---|---|
| Company | Eaton Brad |
| Year | 2016 |
| Patents | 17 |
Patents
Representative publications for Eaton Brad in 2016.
Uv-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
US-2016315009-A1 · Oct 27, 2016 · US
Method and apparatus for dicing wafers having thick passivation polymer layer
US-9460966-B2 · Oct 4, 2016 · US
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
US-9443765-B2 · Sep 13, 2016 · US
Hybrid wafer dicing approach using a polygon scanning-based laser scribing process and plasma etch process
US-2016197015-A1 · Jul 7, 2016 · US
Top CPC classifications
Most common classification codes for Eaton Brad in 2016.
| CPC | Patents |
|---|---|
| H10P54/00 | 16 |
| H10P50/242 | 15 |
| H10P72/0468 | 15 |
| H01L21/3065 | 12 |
| H01L21/67069 | 11 |
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