Halbach array and magnetic suspension damper using same
US-10170972-B2 · Jan 1, 2019 · US
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Shanghai Microelectronics Equi — Mechanical Engineering
Shanghai Microelectronics Equi holds 4 patents in Mechanical Engineering, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Shanghai Microelectronics Equi |
| Technology | Mechanical Engineering |
| Patents in slice | 4 |
| Recent patents in slice | 0 |
| First year | 2015 |
| Last year | 2019 |
Representative patents
Notable publications linking Shanghai Microelectronics Equi to Mechanical Engineering.
Silicon wafer edge protection device with collision protection function
US-10041548-B2 · Aug 7, 2018 · US
Negative stiffness system for gravity compensation of micropositioner
US-9752643-B2 · Sep 5, 2017 · US
Negative stiffness system for gravity compensation of micropositioner
US-9752643-B2 · Sep 5, 2017 · US
Negative stiffness system for gravity compensation of micropositioner
US-2015369331-A1 · Dec 24, 2015 · US
Recent filings
Latest patents from Shanghai Microelectronics Equi in Mechanical Engineering.
Halbach array and magnetic suspension damper using same
US-10170972-B2 · Jan 1, 2019 · US
Silicon wafer edge protection device with collision protection function
US-10041548-B2 · Aug 7, 2018 · US
Negative stiffness system for gravity compensation of micropositioner
US-9752643-B2 · Sep 5, 2017 · US
Negative stiffness system for gravity compensation of micropositioner
US-9752643-B2 · Sep 5, 2017 · US
Negative stiffness system for gravity compensation of micropositioner
US-2015369331-A1 · Dec 24, 2015 · US
Related pages
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