Semiconductor device and method of disposing electrical components above and below substrate
US-12489078-B2 · Dec 2, 2025 · US
This page is not indexed by search engines while we improve data quality.
Utac Headquarters Pte Ltd patents in 2025
Utac Headquarters Pte Ltd was listed as an assignee on 13 patent publications in 2025.
| Metric | Value |
|---|---|
| Company | Utac Headquarters Pte Ltd |
| Year | 2025 |
| Patents | 13 |
Patents
Representative publications for Utac Headquarters Pte Ltd in 2025.
Semiconductor device and method of forming an optical semiconductor package with a shield structure
US-12302657-B2 · May 13, 2025 · US
Semiconductor Device and Method of Making a Semiconductor Package with a Pre-Installed Glass Cover
US-2025151421-A1 · May 8, 2025 · US
Semiconductor Device and Method of Making a Semiconductor Package with a Glass Cover
US-2025151447-A1 · May 8, 2025 · US
Semiconductor device and method of forming leadframe with clip bond for electrical interconnect
US-12293972-B2 · May 6, 2025 · US
Top CPC classifications
Most common classification codes for Utac Headquarters Pte Ltd in 2025.
| CPC | Patents |
|---|---|
| H10F39/804 | 7 |
| H10W72/075 | 7 |
| H01L24/48 | 6 |
| H10W72/073 | 6 |
| H10W72/884 | 6 |
Related pages
Navigate to parent entity pages.