Semiconductor device
US-2024421048-A1 · Dec 19, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/48 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 10,257 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 593 |
| 2016 | 665 |
| 2017 | 750 |
| 2018 | 884 |
| 2019 | 1,031 |
| 2020 | 1,014 |
| 2021 | 782 |
| 2022 | 789 |
| 2023 | 958 |
| 2024 | 1,259 |
| 2025 | 1,239 |
| 2026 | 293 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device
US-2024421022-A1 · Dec 19, 2024 · US
Leadframe and semiconductor device
US-2024421050-A1 · Dec 19, 2024 · US
Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Semiconductor packages
US-2024363472-A1 · Oct 31, 2024 · US
Biometric sensor module for a smart card and method for manufacturing such a module
US-12131987-B2 · Oct 29, 2024 · US
Apparatus and method for making a secured substrate
US-2024355722-A1 · Oct 24, 2024 · US
Packages with electrical fuses
US-2024332243-A1 · Oct 3, 2024 · US
Semiconductor device
US-2024282677-A1 · Aug 22, 2024 · US
Semiconductor device
US-12068235-B2 · Aug 20, 2024 · US
Sensor packaging method and sensor package
US-2024222308-A1 · Jul 4, 2024 · US
Semiconductor device
US-2024079290-A1 · Mar 7, 2024 · US
Semiconductor device
US-2024071862-A1 · Feb 29, 2024 · US
Smaller module by stacking
US-2024038743-A1 · Feb 1, 2024 · US
Method of manufacturing semiconductor device and semiconductor device
US-2024006275-A1 · Jan 4, 2024 · US
Low profile wire bonded USB device
US-9218953-B2 · Dec 22, 2015 · US
Non-leaded type semiconductor package and method of assembling same
US-9214447-B2 · Dec 15, 2015 · US
Semiconductor package system with cut multiple lead pads
US-9202777-B2 · Dec 1, 2015 · US
Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch
US-9202713-B2 · Dec 1, 2015 · US
Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate
US-9196562-B2 · Nov 24, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/48?
- CPC H01L24/48 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/48 (Electricity)?
- Our database includes 10,257 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/48 growing?
- Publication counts under this code: 1,259 in 2024 vs 1,239 in 2025 (latest complete years).