Method of making glass core substrate for integrated circuit devices

Patent metadata

Field	Value
Publication number	US-10070524-B2
Application number	US-201213442092-A
Country	US
Kind code	B2
Filing date	Apr 9, 2012
Priority date	Dec 17, 2009
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

First claim

What is claimed is:

1. A method of making a glass core substrate for integrated circuit device comprising:
forming an amorphous solid glass plate, comprising:
forming a casting mold having a number of tapered protrusions;
disposing a molten glass material into the casting mold;
cooling the molten glass to form the amorphous solid glass plate having a first surface and an opposing second surface substantially parallel with the first surface;
removing the amorphous solid glass plate from the casting mold, wherein the tapered protrusions form a number of holes in the amorphous solid glass plate extending from the first surface to the second surface;

disposing a single electrically conductive material in each of the holes to fill each of the holes and form a conductor in each hole, wherein the conductor begins at, without extending beyond, the first surface of the amorphous solid glass plate and ends at, without extending beyond, the second surface of the amorphous solid glass plate;
disposing a first dielectric layer directly on the first surface of the amorphous solid glass plate, disposing a first metal layer on the first surface of the amorphous solid glass plate, and electrically coupling the first metal layer on the first surface of the amorphous solid glass plate with at least one of the conductors; and
disposing a second dielectric layer directly on the second surface of the amorphous solid glass plate, disposing a second metal layer on the second surface of the amorphous solid glass plate, and electrically coupling the second metal layer on the second surface with at least one of the conductors.

2. The method of claim 1 , wherein the electrically conductive material comprises a metal.

3. The method of claim 1 , wherein the at least one metal layer disposed at the first surface of the glass plate is disposed directly adjacent the first surface, and wherein the at least one metal layer disposed at the second surface of the glass plate is disposed directly adjacent the second surface.

4. The method of claim 1 , further comprising:
disposing a first set of terminals at the first side of the glass plate, the first set of terminals to mate with a corresponding array of terminals on an integrated circuit (IC) die; and
disposing a second set of terminals at the second side of the glass plate, the second set of terminals to mate with a corresponding array of terminals on a next-level component.

Assignees

• Ma Qing
• Tran Quan A
• Sankman Robert L
• Swan Johanna M
• Rao Valluri R
• Intel Corp

Inventors

• Ma Qing
• Tran Quan A
• Sankman Robert L
• Swan Johanna M
• Rao Valluri R

Classifications

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• H05K2203/0228

  Cutting, sawing, milling or shearing · CPC title

• Y10T29/49126

  Assembling bases · CPC title

• H05K2203/0108

  Male die used for patterning, punching or transferring · CPC title