Semiconductor die with bond pad formed from nanowires
US-2026026368-A1 · Jan 22, 2026 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/0555 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 35 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2016 | 2 |
| 2017 | 2 |
| 2019 | 8 |
| 2020 | 4 |
| 2021 | 5 |
| 2022 | 5 |
| 2023 | 5 |
| 2025 | 3 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bond structure for stacked ic chips
US-2025323194-A1 · Oct 16, 2025 · US
Bond structure for stacked ic chips
US-2025246565-A1 · Jul 31, 2025 · US
Method for removing residues from a substrate surface
US-2025183088-A1 · Jun 5, 2025 · US
Transistor with odd-mode oscillation stabilization circuit
US-11842996-B2 · Dec 12, 2023 · US
Semiconductor memory device structure
US-11742307-B2 · Aug 29, 2023 · US
Transistor with odd-mode oscillation stabilization circuit
US-2023163121-A1 · May 25, 2023 · US
Wire bonding method for semiconductor package
US-11594503-B2 · Feb 28, 2023 · US
Semiconductor device and method of manufacturing the same
US-2023027674-A1 · Jan 26, 2023 · US
Semiconductor device and method of manufacturing the same
US-11495557-B2 · Nov 8, 2022 · US
Semiconductor device having an inductor
US-11393782-B2 · Jul 19, 2022 · US
Semiconductor device with a semiconductor chip connected in a flip chip manner
US-11355462-B2 · Jun 7, 2022 · US
Semiconductor memory device structure
US-2022157753-A1 · May 19, 2022 · US
Semiconductor memory device structure
US-11264344-B2 · Mar 1, 2022 · US
Wire bonding method for semiconductor package
US-2021358873-A1 · Nov 18, 2021 · US
Semiconductor device and method of manufacturing the same
US-2021296267-A1 · Sep 23, 2021 · US
Semiconductor device and process for fabricating the same
US-11127657-B2 · Sep 21, 2021 · US
Semiconductor device
US-10978381-B2 · Apr 13, 2021 · US
Semiconductor device and method of forming inductor over insulating material filled trench in substrate
US-10903304-B2 · Jan 26, 2021 · US
Semiconductor memory device structure
US-2020357761-A1 · Nov 12, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/0555?
- CPC H01L2224/0555 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/0555 (Electricity)?
- Our database includes 35 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/0555 growing?
- Publication counts under this code: 5 in 2023 vs 3 in 2025 (latest complete years).