Methods to form high density through-mold interconnections
US-9741692-B2 · Aug 22, 2017 · US
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Karhade Omkar G patents
Karhade Omkar G holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | May 26, 2015 |
| Latest publication | Aug 22, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Method and materials for warpage thermal and interconnect solutions
US-9607964-B2 · Mar 28, 2017 · US
Reliable microstrip routing for electronics components
US-9607947-B2 · Mar 28, 2017 · US
Methods to form high density through-mold interconnections
US-2016268231-A1 · Sep 15, 2016 · US
Reliable microstrip routing for electronics components
US-9391025-B2 · Jul 12, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Methods to form high density through-mold interconnections
US-9741692-B2 · Aug 22, 2017 · US
Method and materials for warpage thermal and interconnect solutions
US-9607964-B2 · Mar 28, 2017 · US
Reliable microstrip routing for electronics components
US-9607947-B2 · Mar 28, 2017 · US
Methods to form high density through-mold interconnections
US-2016268231-A1 · Sep 15, 2016 · US
Reliable microstrip routing for electronics components
US-9391025-B2 · Jul 12, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 6 |
| H10W74/15 | 6 |
| H10W90/734 | 6 |
| H10W90/701 | 6 |
| H10W90/00 | 6 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 6 |