Stud bump structure for semiconductor package assemblies
US-9768137-B2 · Sep 19, 2017 · US
This page is not indexed by search engines while we improve data quality.
Lin Hsiu-Jen patents
Lin Hsiu-Jen holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | Jan 6, 2015 |
| Latest publication | Sep 19, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Package on package interconnect structure
US-9607921-B2 · Mar 28, 2017 · US
Warpage control in the packaging of integrated circuits
US-9538582-B2 · Jan 3, 2017 · US
Apparatus and methods for molded underfills in flip chip packaging
US-9412717-B2 · Aug 9, 2016 · US
Packages and methods for forming the same
US-9030022-B2 · May 12, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Stud bump structure for semiconductor package assemblies
US-9768137-B2 · Sep 19, 2017 · US
Package on package interconnect structure
US-9607921-B2 · Mar 28, 2017 · US
Warpage control in the packaging of integrated circuits
US-9538582-B2 · Jan 3, 2017 · US
Apparatus and methods for molded underfills in flip chip packaging
US-9412717-B2 · Aug 9, 2016 · US
Packages and methods for forming the same
US-9030022-B2 · May 12, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 5 |
| H10W72/252 | 5 |
| H01L2924/014 | 5 |
| H01L2224/16225 | 5 |
| H10W74/00 | 4 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 6 |
| Operations & Transport | 2 |
| Cross-Sectional Technologies | 1 |