Packages and methods for forming the same

Patent metadata

Field	Value
Publication number	US-9030022-B2
Application number	US-201113280157-A
Country	US
Kind code	B2
Filing date	Oct 24, 2011
Priority date	Oct 24, 2011
Publication date	May 12, 2015
Grant date	May 12, 2015

Abstract

A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.

First claim

What is claimed is:

1. A device comprising:
a first package component comprising metal pads on a top surface of the first package component;
a polymer region molded over the top surface of the first package component; and
a plurality of openings, wherein each of the metal pads is exposed through one of the plurality of openings, and wherein the plurality of openings comprises:
a first opening having a first horizontal size; and
a second opening having a second horizontal size different from the first horizontal size, wherein each of the first opening and the second opening extends from a top surface of the polymer region to one of the metal pads, and the first horizontal size and the second horizontal size are measured in a direction parallel to the top surface of the polymer region, and the first horizontal size and the second horizontal size are measured at the top surface of the polymer region.

2. The device of claim 1 , wherein the first horizontal size is greater than the second horizontal size, and wherein the first opening is closer to a center of the first package component than the second opening.

3. The device of claim 1 , wherein the first horizontal size is smaller than the second horizontal size, and wherein the first opening is closer to a center of the first package component than the second opening.

4. The device of claim 1 , wherein the first horizontal size is between about 50 percent and about 90 percent of the second horizontal size.

5. The device of claim 1 further comprising a device die bonded to the first package component and molded in the polymer region, wherein the first opening and the second opening are in a region outside of, and encircling, the device die.

6. The device of claim 1 further comprising a second package component bonded to the first package component through a plurality of solder-containing connectors, wherein each of the solder-containing connectors comprises a portion extending into one of the plurality of openings.

7. The device of claim 1 , wherein in directions extending from a center of the first package component to edges of the first package component, horizontal sizes of the plurality of openings increase or decrease gradually.

8. The device of claim 5 wherein the plurality of openings is physically spaced apart from the device die.

9. The device of claim 1 , wherein an entirety of each of the plurality of openings is in the polymer region.

10. The device of claim 1 , wherein sidewalls of the polymer region are exposed to the plurality of openings.

11. The device of claim 1 , wherein the metal pads comprises a first metal pad and a second metal pad, with the first opening and the second opening extending from the top surface of the polymer region to the first metal pad and the second metal pad, respectively, and wherein top surfaces of the first metal pad and the second metal pad are substantially coplanar with each other.

12. A device comprising:
a first package component comprising a plurality of conductive features at a surface;
a device die bonded to a top surface of the first package component;
a molding compound molded on the top surface of the first package component, wherein the device die is molded in the molding compound;
openings in the molding compound, wherein the openings are aligned into a plurality of rings encircling the device die, wherein the openings in each of the plurality of rings have a same horizontal size, and the openings in different ones of the plurality of rings have different horizontal sizes, wherein the horizontal sizes of the openings are measured in a direction parallel to the top surface of the molding compound, and the horizontal sizes of the openings are measured at the top surface of the molding compound;
solder regions filling the openings, wherein each of the solder regions extends from a top surface of the molding compound to contact one of the plurality of conductive features of the first package component; and
a second package component over and bonded to the first package component through the solder regions.

13. The device of claim 12 , wherein outer ones of the plurality of rings encircle inner ones of the plurality of rings, and wherein the horizontal sizes of the outer ones of the plurality of rings are smaller than the horizontal sizes of the inner ones of the plurality of rings.

14. The device of claim 13 , wherein the first package component and the second package component have a negative warpage, with solder regions in the inner ones of the plurality of rings having heights smaller than solder regions in the outer ones of the plurality of rings.

15. The device of claim 12 , wherein outer ones of the plurality of rings encircle inner ones of the plurality of rings, and wherein the horizontal sizes of the outer ones of the plurality of rings are greater than the horizontal sizes of the inner ones of the plurality of rings.

16. The device of claim 15 , wherein the first package component and the second package component have a positive warpage, with solder regions in the inner ones of the plurality of rings having heights greater than solder regions in the outer ones of the plurality of rings.

17. The device of claim 12 , wherein the openings in each of the plurality of rings have a horizontal size different from the horizontal sizes of the openings in all remaining ones of the plurality of rings.

18. The device of claim 12 , wherein the plurality of conductive features are metal pads that have top surfaces substantially level with each other, wherein each of the top surfaces is in physical contact with a bottom surface of one of the solder regions.

19. The device of claim 12 , wherein an entirety of each of the openings is in the molding compound.

20. The device of claim 12 , wherein each of the solder regions extends from a first level higher than a top surface of the device die to at least a second level coplanar with a bottom surface of the device die.

Assignees

• Chen Meng-Tse
• Lin Chun-Cheng
• Tsai Yu-Peng
• Lin Hsiu-Jen
• Cheng Ming-Da
• Liu Chung-Shi
• Taiwan Semiconductor Mfg

Inventors

• Chen Meng-Tse
• Lin Chun-Cheng
• Tsai Yu-Peng
• Lin Hsiu-Jen
• Cheng Ming-Da
• Liu Chung-Shi

Classifications

• H10W74/00 Primary

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title