Thermal interface material layer and package-on-package device including the same
US-9899294-B2 · Feb 20, 2018 · US
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Kim Jongkook patents
Kim Jongkook holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Feb 2, 2016 |
| Latest publication | Feb 20, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Package substrates and integrated circuit packages including the same
US-9370098-B2 · Jun 14, 2016 · US
Package-on-package devices and methods of manufacturing the same
US-9355931-B2 · May 31, 2016 · US
Semiconductor package and method of fabricating the same
US-9252095-B2 · Feb 2, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Thermal interface material layer and package-on-package device including the same
US-9899294-B2 · Feb 20, 2018 · US
Package substrates and integrated circuit packages including the same
US-9370098-B2 · Jun 14, 2016 · US
Package-on-package devices and methods of manufacturing the same
US-9355931-B2 · May 31, 2016 · US
Semiconductor package and method of fabricating the same
US-9252095-B2 · Feb 2, 2016 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |
| Cross-Sectional Technologies | 1 |