Semiconductor device and method of forming interposer with opening to contain semiconductor die
US-9875911-B2 · Jan 23, 2018 · US
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Chi Heejo patents in 2018
Chi Heejo was listed as an assignee on 1 patent publication in 2018.
| Metric | Value |
|---|---|
| Company | Chi Heejo |
| Year | 2018 |
| Patents | 1 |
Patents
Representative publications for Chi Heejo in 2018.
Top CPC classifications
Most common classification codes for Chi Heejo in 2018.
| CPC | Patents |
|---|---|
| H01L21/56 | 1 |
| H01L21/568 | 1 |
| H01L21/6835 | 1 |
| H01L2221/68345 | 1 |
| H01L2224/0401 | 1 |
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