Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
US-9786627-B2 · Oct 10, 2017 · US
Becker Martin holds 7 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 7 |
| Recent patents | 0 |
| First publication | Dec 29, 2015 |
| Latest publication | Oct 10, 2017 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
US-9786627-B2 · Oct 10, 2017 · US
US-9739172-B2 · Aug 22, 2017 · US
US-9638059-B2 · May 2, 2017 · US
US-2017026366-A1 · Jan 26, 2017 · US
US-9470146-B2 · Oct 18, 2016 · US
Representative or frequently cited publications from precomputed assignee stats.
US-9786627-B2 · Oct 10, 2017 · US
US-9739172-B2 · Aug 22, 2017 · US
US-9638059-B2 · May 2, 2017 · US
US-2017026366-A1 · Jan 26, 2017 · US
US-9470146-B2 · Oct 18, 2016 · US
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Mechanical Engineering | 4 |
| Electricity | 3 |
| Cross-Sectional Technologies | 3 |
| Human Necessities | 1 |
| Operations & Transport | 1 |
| Physics | 1 |
Answers are generated from the same data shown on this page.