Image sensor manufacturing methods
US-9721984-B2 · Aug 1, 2017 · US
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Wei Kuo-Hsiu patents
Wei Kuo-Hsiu holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | Jun 23, 2015 |
| Latest publication | Aug 1, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Wafer edge trim blade with slots
US-9676114-B2 · Jun 13, 2017 · US
Modular grinding apparatuses and methods for wafer thinning
US-9570311-B2 · Feb 14, 2017 · US
Apparatus for wafer grinding
US-9120194-B2 · Sep 1, 2015 · US
Methods for minimizing edge peeling in the manufacturing of BSI chips
US-9064770-B2 · Jun 23, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Image sensor manufacturing methods
US-9721984-B2 · Aug 1, 2017 · US
Wafer edge trim blade with slots
US-9676114-B2 · Jun 13, 2017 · US
Modular grinding apparatuses and methods for wafer thinning
US-9570311-B2 · Feb 14, 2017 · US
Apparatus for wafer grinding
US-9120194-B2 · Sep 1, 2015 · US
Methods for minimizing edge peeling in the manufacturing of BSI chips
US-9064770-B2 · Jun 23, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 3 |
| Electricity | 3 |
| Cross-Sectional Technologies | 1 |