Exposed-die mold package for a sensor and method for encapsulating a sensor that interacts with the environment
US-10717645-B2 · Jul 21, 2020 · US
Feyh Ando holds 7 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 7 |
| Recent patents | 0 |
| First publication | Nov 10, 2016 |
| Latest publication | Jul 21, 2020 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
US-10717645-B2 · Jul 21, 2020 · US
US-10545108-B2 · Jan 28, 2020 · US
US-10317211-B2 · Jun 11, 2019 · US
US-10060888-B2 · Aug 28, 2018 · US
US-2018011043-A1 · Jan 11, 2018 · US
Representative or frequently cited publications from precomputed assignee stats.
US-10717645-B2 · Jul 21, 2020 · US
US-10545108-B2 · Jan 28, 2020 · US
US-10317211-B2 · Jun 11, 2019 · US
US-10060888-B2 · Aug 28, 2018 · US
US-2018011043-A1 · Jan 11, 2018 · US
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Physics | 7 |
| Electricity | 5 |
| Operations & Transport | 4 |