Exposed-die mold package for a sensor and method for encapsulating a sensor that interacts with the environment

Patent metadata

Field	Value
Publication number	US-10717645-B2
Application number	US-201515535687-A
Country	US
Kind code	B2
Filing date	Dec 17, 2015
Priority date	Dec 17, 2014
Publication date	Jul 21, 2020
Grant date	Jul 21, 2020

Abstract

A method of encapsulating a sensor device includes providing at least one sensor device that has a sensor portion on a substrate. An exclusionary zone is formed above an upper surface of the sensor portion. An outer boundary is formed on or about the sensor device with the outer boundary encircling the exclusionary zone. A mold material is deposited into a volume defined in part by the sensor device, the exclusionary zone, and the outer boundary to encapsulate portions of the sensor device. The exclusionary zone in one embodiment is an inner boundary that is formed on the sensor portion. The inner boundary encircles a portion of the upper surface of the sensor portion. The exclusionary zone in another embodiment is a selectively removable material deposited on the upper surface of the sensor portion. The selectively removable material occupies a space above a portion of the upper surface.

First claim

What is claimed is:

1. A method of encapsulating a sensor device in an exposed-die mold package, comprising:
providing a first sensor on a substrate, the first sensor having a first upper surface with a first exposed sensor area defined in a portion of the first upper surface;
depositing a first dam on the first upper surface thereby forming a first exclusionary zone including the first exposed sensor area;
depositing first mold material onto the first sensor about the first exclusionary zone; and
encapsulating the first sensor with the deposited first mold material such that one or more of the deposited first dam and the deposited first mold material defines a first opening that permanently fluidically connects the first exposed sensor area to an environment external to the sensor device,
wherein no material contacts the first exposed sensor area or otherwise obstructs the first opening after the first sensor is encapsulated with the deposited first mold material.

2. The method of claim 1 , further comprising:
removing the deposited first dam after encapsulating the first sensor.

3. The method of claim 1 , further comprising:
forming a second dam spaced apart from and encircling the first dam, wherein depositing first mold material comprises:
depositing first mold material within a space between the first dam and the second dam.

4. The method of claim 1 , further comprising:
providing a second sensor on the substrate, the second sensor having a second upper surface with a second exposed sensor area defined in a portion of the second upper surface;
depositing a second dam on the second upper surface thereby forming a second exclusionary zone including the second exposed sensor area;
depositing second mold material onto the second sensor about the second exclusionary zone; and
encapsulating the second sensor with the deposited second mold material such that one or more of the deposited second dam and the deposited second mold material defines a second opening that permanently fluidically connects the second exposed sensor area to the environment.

5. The method of claim 4 , further comprising:
forming a third dam spaced apart from and encircling only the first dam; and
forming a fourth dam spaced apart from and encircling only the second dam,
wherein depositing the first mold material comprises depositing the first mold material within a first space between the first dam and the third dam, and
wherein depositing the second mold material comprises depositing the second mold material within a second space between the second dam and the fourth dam.

6. The method of claim 4 , further comprising:
forming a third dam spaced apart from and encircling the first dam and the second dam.

7. The method of claim 1 , wherein depositing the first dam comprises:
depositing the first dam such that the first dam encircles a portion of the first upper surface including the first exposed sensor area.

8. The method of claim 7 , wherein depositing the first dam further comprises:
pressing an insert on the first sensor.

9. The method of claim 7 , wherein depositing the first dam further comprises:
depositing a bead of material on the first sensor.

10. The method of claim 1 , wherein:
the first sensor includes at least one bond wire electrically connecting the first sensor to the substrate, and
the first dam is deposited such that the at least one bond wire is encapsulated by the deposited first mold material.

11. The method of claim 1 , wherein:
depositing first mold material comprises depositing a polymer compound having a first liquid or semi-liquid state, and
encapsulating the first sensor with the deposited first mold material comprises encapsulating the first sensor with the deposited polymer compound having a second semi-solid or solid state.

12. The method of claim 1 , wherein:
providing the first sensor on the substrate comprises providing an application specific integrated circuit (ASIC) and the first sensor on the substrate, the ASIC operatively connected to the first sensor via at least one bond wire, and
encapsulating the first sensor with the deposited first mold material comprises encapsulating the ASIC, the at least one bond wire, and the first sensor with the deposited first mold material.

13. A method of encapsulating a plurality of sensor devices in respective exposed-die mold packages, comprising:
providing a first sensor on a substrate, the first sensor having a first upper surface with a first exposed sensor area defined in a portion of the first upper surface;
providing a second sensor on the substrate, the second sensor having a second upper surface with a second exposed sensor area defined in a portion of the second upper surface;
depositing a first dam on the first upper surface thereby forming a first exclusionary zone including the first exposed sensor area;
depositing a second dam on the second upper surface thereby forming a second exclusionary zone including the second exposed sensor area;
depositing mold material onto (i) the first sensor about the first exclusionary zone and (ii) the second sensor about the second exclusionary zone; and
encapsulating the first sensor and the second sensor with the deposited mold material, the first sensor encapsulated such that one or more of the deposited first dam and the deposited mold material defines a first opening that fluidically connects the first exposed sensor area to an environment external to the sensor device.

14. The method of claim 13 , further comprising:
singulating the encapsulated first and second sensors such that the first sensor is associated with a singulated first portion of the substrate and the second sensor is associated with a singulated second portion of the substrate.

Assignees

• Bosch Gmbh Robert
• Feyh Ando
• Obrien Gary

Inventors

• Feyh Ando
• O'Brien Gary

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title