Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
US-2018195951-A1 · Jul 12, 2018 · US
This page is not indexed by search engines while we improve data quality.
Industry Academic Cooperation Foundation Yeungnam Univ patents in 2018
Industry Academic Cooperation Foundation Yeungnam Univ was listed as an assignee on 2 patent publications in 2018.
| Metric | Value |
|---|---|
| Company | Industry Academic Cooperation Foundation Yeungnam Univ |
| Year | 2018 |
| Patents | 2 |
Patents
Representative publications for Industry Academic Cooperation Foundation Yeungnam Univ in 2018.
Top CPC classifications
Most common classification codes for Industry Academic Cooperation Foundation Yeungnam Univ in 2018.
| CPC | Patents |
|---|---|
| G01M1/00 | 2 |
| G01N19/04 | 2 |
| G01N2203/0017 | 2 |
| G01N2203/0025 | 2 |
| H10P74/203 | 2 |
Related pages
Navigate to parent entity pages.