Method of making multi-layer electronic components with plated terminations
US-9666366-B2 · May 30, 2017 · US
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Heistand Ii Robert patents in 2017
Heistand Ii Robert was listed as an assignee on 1 patent publication in 2017.
| Metric | Value |
|---|---|
| Company | Heistand Ii Robert |
| Year | 2017 |
| Patents | 1 |
Patents
Representative publications for Heistand Ii Robert in 2017.
Top CPC classifications
Most common classification codes for Heistand Ii Robert in 2017.
| CPC | Patents |
|---|---|
| C23C18/1651 | 1 |
| C23C18/1653 | 1 |
| C23C18/32 | 1 |
| C23C18/38 | 1 |
| C23C18/48 | 1 |
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