Method of fabricating a flip-chip package core substrate with build-up layers
US-12154866-B2 · Nov 26, 2024 · US
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Phoenix Pioneer Technology Co Ltd patents in 2024
Phoenix Pioneer Technology Co Ltd was listed as an assignee on 19 patent publications in 2024.
| Metric | Value |
|---|---|
| Company | Phoenix Pioneer Technology Co Ltd |
| Year | 2024 |
| Patents | 19 |
Patents
Representative publications for Phoenix Pioneer Technology Co Ltd in 2024.
Semiconductor package structure and manufacturing method thereof
US-12100665-B2 · Sep 24, 2024 · US
Inductance traces protected through shielding layers
US-12094922-B2 · Sep 17, 2024 · US
Electronic package
US-12080466-B2 · Sep 3, 2024 · US
Manufacturing method of semiconductor package structure
US-12080670-B2 · Sep 3, 2024 · US
Top CPC classifications
Most common classification codes for Phoenix Pioneer Technology Co Ltd in 2024.
| CPC | Patents |
|---|---|
| H01F17/0013 | 8 |
| H10W70/05 | 8 |
| H10W70/685 | 8 |
| H01L23/49822 | 7 |
| H10W70/093 | 7 |
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