Flip-chip packaging substrate and method for fabricating the same
US-2022406734-A1 · Dec 22, 2022 · US
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Phoenix Pioneer Technology Co Ltd patents in 2022
Phoenix Pioneer Technology Co Ltd was listed as an assignee on 20 patent publications in 2022.
| Metric | Value |
|---|---|
| Company | Phoenix Pioneer Technology Co Ltd |
| Year | 2022 |
| Patents | 20 |
Patents
Representative publications for Phoenix Pioneer Technology Co Ltd in 2022.
Semiconductor packaging substrate, fabrication method and packaging process thereof
US-11508673-B2 · Nov 22, 2022 · US
Manufacturing method of an integrated driving module with energy conversion function
US-11495379-B2 · Nov 8, 2022 · US
Flip-chip package substrate
US-11488911-B2 · Nov 1, 2022 · US
Flip-chip packaging substrate and method for fabricating the same
US-11476204-B2 · Oct 18, 2022 · US
Top CPC classifications
Most common classification codes for Phoenix Pioneer Technology Co Ltd in 2022.
| CPC | Patents |
|---|---|
| H10W90/724 | 16 |
| H10W70/685 | 14 |
| H10W70/65 | 13 |
| H10W90/701 | 13 |
| H10W70/05 | 11 |
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