Manufacturing method of an integrated driving module with energy conversion function

Patent metadata

Field	Value
Publication number	US-11495379-B2
Application number	US-202016878682-A
Country	US
Kind code	B2
Filing date	May 20, 2020
Priority date	Aug 31, 2018
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

First claim

What is claimed is:

1. A manufacturing method of an integrated driving module with energy conversion function, comprising:
providing a carrier board;
forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board;
forming a patterned conductive circuit layer on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components;
disposing an embedded electrical component on the patterned conductive circuit layer;
disposing a conductive component on the patterned conductive circuit layer;
forming a second dielectric layer to cover the embedded electrical component and the conductive component; and
removing the carrier board to form a plurality of integrated driving modules.

2. The manufacturing method according to claim 1 , wherein the step for forming the integrated electromagnetic induction component layer further comprising:
forming a first sub-dielectric layer on the surface of the carrier board;
forming a first conductive coil layer on a surface of the first sub-dielectric layer;
forming a second sub-dielectric layer to cover the first conductive coil layer and the first sub-dielectric layer, and to expose a part of the first conductive coil layer;
forming a first conductive connecting component on the exposed first conductive coil layer;
forming a second conductive coil layer on the second sub-dielectric layer and the first conductive connecting component;
forming a third sub-dielectric layer to cover the second sub-dielectric layer and the second conductive coil layer; and
selectively repeating the above steps.

3. The manufacturing method according to claim 1 , further comprises selectively grinding an upper surface of the second dielectric layer, to expose an end face of the conductive component.

4. The manufacturing method according to claim 1 , further comprises forming at least one opening, to expose a part of the patterned conductive circuit layer.

5. The manufacturing method according to claim 1 , further comprises cutting the integrated driving module, to form individual integrated driving module.

6. The manufacturing method according to claim 1 , wherein the carrier board has at least one alignment marker, and before implementing each processing step further comprises aligning according to the alignment marker.

Assignees

• Phoenix & Corp
• Phoenix Pioneer Technology Co Ltd

Inventors

• Hu Wen-Hung
• Chen Tsung-Yueh

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title