Flip-chip package substrate and method for fabricating the same
US-11183447-B2 · Nov 23, 2021 · US
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Phoenix Pioneer Technology Co Ltd patents in 2021
Phoenix Pioneer Technology Co Ltd was listed as an assignee on 10 patent publications in 2021.
| Metric | Value |
|---|---|
| Company | Phoenix Pioneer Technology Co Ltd |
| Year | 2021 |
| Patents | 10 |
Patents
Representative publications for Phoenix Pioneer Technology Co Ltd in 2021.
Manufacturing method for semiconductor package structure
US-2021320096-A1 · Oct 14, 2021 · US
Flip-chip package substrate and method for preparing the same
US-11139230-B2 · Oct 5, 2021 · US
Semiconductor packaging substrate, fabrication method and packaging process thereof
US-2021296260-A1 · Sep 23, 2021 · US
Package substrate and method for manufacturing the same
US-2021296259-A1 · Sep 23, 2021 · US
Top CPC classifications
Most common classification codes for Phoenix Pioneer Technology Co Ltd in 2021.
| CPC | Patents |
|---|---|
| H10W90/701 | 9 |
| H10W90/724 | 9 |
| H10W70/635 | 8 |
| H01L21/4857 | 7 |
| H10W70/05 | 7 |
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