Capacitor-referenced temperature sensing
US-9523615-B1 · Dec 20, 2016 · US
US9998089B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9998089-B2 |
| Application number | US-201314650658-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 13, 2013 |
| Priority date | Dec 14, 2012 |
| Publication date | Jun 12, 2018 |
| Grant date | Jun 12, 2018 |
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A resonator device 10 is disclosed. The resonator device may be used in a transducer or a sensor such as a pressure, force or acceleration sensor. The resonator device comprises a resonator 20 provided on a diaphragm 30 . A cap 40 is provided which may be fusion bonded to the diaphragm 30 to enclose the resonator 20 and form a hermetically sealed package 10 . The resonator device is excited by applying electromagnetic stimulation, such as infra-red or optical stimulation, which may be from a laser via a fiber 50 . The resonator device may be interrogated by applying an electromagnetic signal into the optical cavity formed between the resonator 20 and the inside surface of the cap 40 to derive a frequency change of the resonator. As the resonator device incorporates a hermetically sealed package and is stimulated by electromagnetic radiation, it is robust and able to operate in harsh environments.
Opening claim text (preview).
The invention claimed is: 1. A resonator device for a transducer, the resonator device comprising: a resonator provided on a diaphragm with a cap enclosing the resonator and forming an optical cavity between inside surface of the cap and the resonator, to form a hermetically sealed package, wherein the resonator is arranged to be excited by applying electromagnetic stimulation, wherein the resonator is provided with a target to receive the electromagnetic stimulation, and wherein a diameter of the target is larger than a diameter of a fibre which is used to apply the electromagnetic stimulation. 2. The resonator device of claim 1 , wherein the electromagnetic stimulation is applied from outside the hermetically sealed package. 3. The resonator device of claim 1 , wherein at least a portion of the cap is transparent to electromagnetic radiation from the electromagnetic stimulation. 4. The resonator device of claim 1 , wherein the resonator device is arranged to be interrogated by applying an electromagnetic signal into the optical cavity, formed between the inside surface of the cap and the resonator, to derive a frequency change of the resonator. 5. The resonator device of claim 4 , wherein the electromagnetic stimulation of the resonator and the electromagnetic signal to interrogate the resonator device are both applied through a same fibre. 6. The resonator device of claim 4 , wherein the electromagnetic stimulation and interrogating electromagnetic signal are of different wavelengths. 7. The resonator device of claim 1 , wherein each of the resonator, the diaphragm, and the cap are formed from silicon wafers that are fusion bonded together to create an evacuated hermetically sealed package. 8. The resonator device of claim 1 , wherein the resonator device is arranged to measure thermal expansion or thermal contraction of a thickness of the cap to determine temperature. 9. The resonator device of claim 8 , wherein the measured thermal expansion or thermal contraction of the thickness of the cap is used to compensate for thermally induced resonator frequency changes. 10. The resonator device of claim 1 , wherein the diameter of the target is at least ten times the diameter of the fibre. 11. The resonator device of claim 10 , wherein the target is coated with a light absorbing layer. 12. A pressure transducer including the resonator device according to claim 1 . 13. An acceleration sensor including the resonator device according to claim 1 . 14. A force sensor including the resonator device according to claim 1 . 15. A method of fabricating a resonator device, the method comprising: providing wafers comprising a diaphragm wafer, a resonator wafer and a cap wafer; forming an optical cavity between an inside surface of the cap wafer and the resonator wafer; bonding the wafers together to form a hermetically sealed package with the resonator wafer enclosed by the diaphragm wafer and the cap wafer; arranging the hermetically sealed package to apply an electromagnetic radiation to the hermetically sealed package; and positioning a target on a surface of the resonator to receive the electromagnetic radiation, wherein a diameter of the target is larger than a diameter of a fibre which is used to apply the electromagnetic radiation. 16. The method of claim 15 , wherein the electromagnetic radiation is applied extrinsically to the hermetically sealed package. 17. A resonator device for a transducer, the resonator device comprising: a resonator positioned on a diaphragm, and a cap enclosing the resonator to form an optical cavity between an inside surface of the cap and the resonator, wherein the resonator is arranged to be excited by applying an electromagnetic radiation, and wherein an electromagnetic signal, having a different wavelength than the electromagnetic radiation, is applied into the optical cavity to derive a frequency change of the resonator. 18. The resonator device of claim 17 , wherein the electromagnetic radiation of the resonator and the electromagnetic signal applied to the optical cavity of the resonator device are both applied through a same fibre. 19. The resonator device of claim 17 , wherein the resonator device includes a hermetically sealed package defined by the cap which encloses the resonator and the diaphragm. 20. The resonator of claim 17 , wherein the resonator device is arranged to measure thermal expansion or thermal contraction of a thickness of the cap to determine a temperature.
of microelectro-mechanical resonators or networks (micromembranes or microbeams B81B2203/01; manufacture of microstructural devices in general B81C) · CPC title
Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26) · CPC title
for measuring reflected light · CPC title
using change of resonant frequency of a crystal · CPC title
optical excitation or measuring of vibrations · CPC title
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