LED (light-emitting diode) module and a light apparatus

Patent metadata

Field	Value
Publication number	US-9997690-B1
Application number	US-201715635200-A
Country	US
Kind code	B1
Filing date	Jun 28, 2017
Priority date	Jun 2, 2017
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

An LED chip module includes a first electrode plate and a second electrode plate. A first set of LED chip and a second set of LED chip are respectively set on the first electrode plate and the second electrode plate. The second set of LED chip is electrically connected to the first set of LED chip. A plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding to make the first electrode plate and the second electrode plate keep a predetermined space between each other and make a lower surface of the first electrode plate and a lower surface of the second electrode plate be respectively connected to two different polarity terminals of the power supply to drive the first set of LED chip and the second set of LED chip to emit light.

First claim

The invention claimed is:

1. An LED (Light-Emitting Diode) chip module comprising:
a first electrode plate, wherein a first set of LED chip is set on the upper surface of the first electrode plate;
a second electrode plate, wherein a second set of LED (Light Emitting Diode) chip is set on the upper surface of the second electrode plate, and the second set of LED chip is electrically connected to the first set of LED chip;
a plastic shell, wherein the plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding to make the first electrode plate and the second electrode plate keep a predetermined space between each other and make a lower surface of the first electrode plate and a lower surface of the second electrode plate be respectively connected to two different polarity terminals of the power supply to drive the first set of LED chip and the second set of LED chip to emit light; and
fluorescent, wherein the fluorescent covers the first set of LED chip and the second set of LED chip.

2. The LED chip module of claim 1 , wherein the first set of LED chip and the second set of LED chip have a plurality of LED chips, the plurality of LED chips are electrically connected together in series, and two ends of the LED chip in series are each connected to the first electrode plate and the second electrode plate.

3. The LED chip module of claim 2 , wherein the plurality of LED chips are connected in series by a metal wire.

4. The LED chip module of claim 2 , wherein the first plurality of LED chips are kept unaligned, and at least two of the LED chips are spaced apart by more than 5 degrees.

5. The LED chip module of claim 1 , wherein an area of the first electrode plate is larger than an area of the second electrode plate, and a number of LED chips in the first set of LED chip is larger than a number of LED chips of the second set of LED chip.

6. The LED chip module of claim 1 , wherein the first set of LED chip and the second set of LED chip are each fixed to the first electrode plate and the second electrode plate through an insulating adhesive.

7. The LED chip module of claim 6 , wherein the insulating adhesive has a heat dissipation effect.

8. The LED chip module of claim 1 , wherein a direction which the first electrode plate and the second electrode plate are perpendicular to each other is an extending direction, length of the first electrode plate and the second electrode plate in an extending direction is larger than 90% with respect to the total length of a plastic shell in the extending direction.

9. The LED chip module of claim 1 , wherein the plastic shell has a surrounding portion at a portion of four corners to strengthen adhesion for the first electrode plate and the second electrode plate.

10. The LED chip module of claim 1 , wherein the first electrode plate and the second electrode plate have at least one perforation, when injecting to the plastic shell, ingredients extend to the perforations to strengthen adhesion for the first electrode plate and the second electrode plate.

11. A light apparatus, comprising:
a substrate;
a plurality of patterned wires being set on the substrate;
a plurality of LED chip modules, wherein each of the LED chip module comprises a first electrode plate, and a first set of LED chip is set on an upper surface of the first electrode plate, each of the LED chip module comprises a second electrode plate, and a second set of LED chip is electrically connected to the first set of LED chip, a plastic shell through the plastic shell is formed by injection molding and fixedly connected to the first electrode plate and the second electrode plate so that the first electrode plate and the second electrode plate are spaced apart from each other by a predetermined space, the lower surface of the first electrode plate and the lower surface of the second electrode plate are respectively connected to two different polarity terminals of the power supply for driving the first set of LED chip and the second set of LED chip to emit light, and fluorescent coating covers the first set of LED chip and the second set of LED chip; and
a driving circuit, wherein the driving circuit is connected to a part of plurality of patterned wires to drive the plurality of LED chip modules to emit light, the plurality of patterned wires have a flat heat sink portion thermally connected to the first electrode plate and the second electrode plate of plurality of LED chip modules, and an area of plurality of flat heat dissipating portions is at least a portion corresponding to the number of the LED chips carried on the first electrode plate and the second electrode plate thermally connected.

12. The light apparatus of claim 11 , wherein the flat heat dissipation portion is the patterned wire extension portion electrically connected to the first electrode plate or the second electrode plate, and the plurality of patterns of the patterned wires are distributed according to a distribution of heat to uniformly heat dissipation.

13. The light apparatus of claim 11 , wherein the first set of LED chip and the second set of LED chip have a plurality of LED chips, the plurality of LED chips are electrically connected together in series, and two ends of the LED chip in series are each connected to the first electrode plate and the second electrode plate.

14. The light apparatus of claim 13 , wherein the plurality of LED chips are connected in series by a metal wire.

15. The light apparatus of claim 13 , wherein the first plurality of LED chips are kept unaligned, and at least two of the LED chips are spaced apart by more than 5 degrees.

16. The light apparatus of claim 11 , wherein an area of the first electrode plate is larger than an area of the second electrode plate, and a number of LED chips in the first set of LED chip is larger than a number of LED chips of the second set of LED chip.

17. The light apparatus claim 11 , wherein the first set of LED chip and the second set of LED are each fixed to the first electrode plate and the second electrode plate through an insulating adhesive.

18. The light apparatus of claim 11 , wherein the insulating adhesive has a heat dissipation effect.

19. The light apparatus of claim 11 , wherein a direction the first electrode plate and the second electrode plate are perpendicular to each other is an extending direction, length of the first electrode plate and the second electrode plate in an extending direction is larger than 90% with respect to the total length of a plastic shell in the extending direction.

20. The light apparatus of claim 11 , wherein the plastic shell has a surrounding portion at a portion of four corners to strengthen adhesion for the first electrode plate and the second electrode plate.

Assignees

• Xiamen Eco Lighting Co Ltd

Inventors

• Cao Liangliang
• Chen Huiwu
• Wang Qiyuan

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• F21V19/0025

  the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections · CPC title