Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Multi-chip light emitter packages and related methods
US9172012B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9172012-B2 |
| Application number | US-201313796045-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 12, 2013 |
| Priority date | Oct 31, 2007 |
| Publication date | Oct 27, 2015 |
| Grant date | Oct 27, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrical contacts disposed on a same side. The positive and negative electrical contacts can be adapted to electrically communicate to conductive portions of the submount. Light emitter packages can further include a lens overmolded on the submount and covering a portion of the array.
First claim
Opening claim text (preview).
We claim: 1. A method of providing a light emitter package, the method comprising: providing a submount having a planar upper surface; providing an array of light emitter chips disposed over a portion of the planar upper surface of the submount in a rectangular arrangement; connecting each light emitter chip of the array of light emitter chips to conductive portions of the submount via non-wire bond connections; and providing a lens over the array of light emitter chips, whe…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9172012B2 cover?
- Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrica…
- Who is the assignee on this patent?
- Cree Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).