BEOL vertical fuse formed over air gap

US9997454B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9997454-B2
Application numberUS-201615358701-A
CountryUS
Kind codeB2
Filing dateNov 22, 2016
Priority dateFeb 23, 2016
Publication dateJun 12, 2018
Grant dateJun 12, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of forming an electrical device that includes forming a first level including an array of metal lines, wherein an air gap is positioned between the adjacent metal lines. A second level is formed including at least one dielectric layer atop the first level. A plurality of trench structures is formed in the at least on dielectric layer. At least one of the plurality of trench structures opens the air gap. A conductive material is formed within the trenches. The conductive material deposited in the open air gap provides a vertical fuse.

First claim

Opening claim text (preview).

What is claimed is: 1. An electrical device comprising: a first level comprised of an array of metal lines, wherein a plurality of air gaps are present separating adjacent metal layers in the array of metal lines and one of the air gaps includes a fuse structure present therein; and a second level including a plurality of trenches in an interlevel dielectric layer that contain electrically conductive material, wherein a first set of the plurality of trenches including said electrically conductive material extends into at least one of the air gaps to provide a vertical fuse, and a second set of trenches containing the electrically conductive material does not extend to the first level and provides interconnect structures. 2. The electrical device of claim 1 , wherein the first set of the plurality of trenches includes a line portion having a first depth and a via portion having a second depth, the second depth being greater than the first depth and extending to the air gaps. 3. The electrical device of claim 2 , wherein the via portions provide a first contact region and a second contract region to the vertical fuse, and the electrically conductive material in the air gaps provides a fuse link. 4. The electrical device of claim 3 , wherein at least one interface between the via portions that provide the first contact region and the second contact region and the electrically conductive material in the air gap that provides the fuse link has a necked opening with a width that is less than half the dimension separating adjacent metal lines in the array of metal lines. 5. The electrical device of claim 4 , wherein said with of the necked region ranges from 5 nm to 40 nm. 6. The electrical device of claim 3 , wherein the fuse link is entirely present in the first level. 7. The electrical device of claim 1 , wherein the vertical fuse is blown by currents ranging from 10 mA to 15 mA.

Assignees

Inventors

Classifications

  • for dual-damascene structures · CPC title

  • of dielectric parts comprising air gaps · CPC title

  • comprising air gaps · CPC title

  • by filling between adjacent conductive parts · CPC title

  • by forming openings in the dielectric parts · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9997454B2 cover?
A method of forming an electrical device that includes forming a first level including an array of metal lines, wherein an air gap is positioned between the adjacent metal lines. A second level is formed including at least one dielectric layer atop the first level. A plurality of trench structures is formed in the at least on dielectric layer. At least one of the plurality of trench structures …
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H10W20/493. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 12 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).