Method and apparatus for wafer wet processing

Patent metadata

Field	Value
Publication number	US-9997379-B2
Application number	US-95698810-A
Country	US
Kind code	B2
Filing date	Nov 30, 2010
Priority date	Nov 30, 2010
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

A gas dispenser in a process module for wet processing of wafer-shaped articles is substantially smaller than the article to be processed and is movable laterally of the article as it dispenses inert gas above the article.

First claim

What is claimed is:

1. A method for processing wafer shaped articles, comprising:
positioning a wafer-shaped article on a holder;
positioning a gas dispenser above the wafer-shaped article at a defined operating distance;
dispensing an inert gas above the wafer-shaped article;
dispensing an etching liquid onto the wafer-shaped article simultaneously with said dispensing an inert gas above the wafer-shaped article; and
moving the gas dispenser laterally relative to the wafer-shaped article while dispensing said inert gas;
wherein the etching liquid is dispensed from a nozzle carried by the gas dispenser.

2. The method according to claim 1 , wherein the gas dispenser has a size such that it overlaps the wafer-shaped article in an area that is from 5 to 50% of an area of an upwardly facing surface of the wafer-shaped article.

3. The method according to claim 1 , wherein said dispensing of an inert gas above the wafer-shaped article comprises dispensing inert gas through an annular nozzle in a direction substantially parallel to an upwardly-facing surface of the wafer-shaped article.

4. The method according to claim 1 , wherein said dispensing of an inert gas above the wafer-shaped article comprises dispensing inert gas through a plurality of downwardly directed gas outlets configured to dispense inert gas downwardly toward the wafer-shaped article.

5. The method according to claim 1 , wherein said dispensing of an inert gas above the wafer-shaped article comprises dispensing inert gas through an annular nozzle in a direction substantially parallel to an upwardly-facing surface of the wafer-shaped article, and dispensing inert gas through a plurality of downwardly directed gas outlets configured to dispense inert gas downwardly toward the wafer-shaped article.

6. The method according to claim 5 , wherein inert gas is dispensed through the annular nozzle via outlets surrounding and directed outwardly of the plurality of downwardly directed gas outlets.

Assignees

• Kraus Harald
• Nardoni Marco
• Brugger Michael
• Lam Res Ag

Inventors

• Kraus Harald
• Nardoni Marco
• Brugger Michael

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P50/00 Primary

  Etching of wafers, substrates or parts of devices · CPC title

• H01L21/67051 Primary

  Electricity · mapped topic

• C23F1/00

  Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) · CPC title