Active-light-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-9996003-B2
Application number	US-201715399953-A
Country	US
Kind code	B2
Filing date	Jan 6, 2017
Priority date	Jul 9, 2014
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

Provided are an active-light-sensitive or radiation-sensitive resin composition having high depth of focus and excellent resolving power; a pattern forming method using the composition; and a method for manufacturing an electronic device. The composition is an active-light-sensitive or radiation-sensitive resin composition containing a resin (P), in which the resin (P) includes a repeating unit (a) having an acid-decomposable group and a repeating unit (b) having a lactone structure and the like; the repeating unit (a) includes at least a specific repeating unit (a1) represented by General Formula (1); the content of the repeating units (a1) with respect to all the repeating units of the resin (P) is 35% by mole or more; and the resin (P) does not include any of a specific group represented by General Formula (X1), a specific structure represented by General Formula (X2), a hydroxyadamantyl group, and a hydroxyadamantyl group in which a hydroxy group is protected with a group that decomposes by the action of an acid to leave.

First claim

What is claimed is:

1. An active-light-sensitive or radiation-sensitive resin composition comprising:
a solvent;
a resin (P); and
a compound that generates an acid upon irradiation with active light or radiation,
wherein the resin (P) includes a repeating unit (a) having a group that decomposes by the action of an acid to generate a polar group, and a repeating unit (b) having at least one of a lactone structure, a sultone structure, or a carbonate structure,
the lactone structure includes a 5-membered ring moiety therein,
the repeating unit (a) includes at least the repeating unit (a1) represented by the following General Formula (1),
when the lactone structure is polycyclic, the sultone structure is monocyclic or polycyclic, and the carbonate structure is monocyclic or polycyclic, the content of the repeating units (a1) with respect to all the repeating units of the resin (P) is 35% by mole or more, and when the lactone structure is monocyclic, the content of the repeating units (a1)with respect to all the repeating units of the resin (P) is 60% by mole or more, and
the resin (P) does not include any of a group represented by the following General Formula (X1), a structure represented by the following General Formula (X2), a hydroxyadamantyl group, and a hydroxyadamantyl group in which a hydroxy group is protected with a group that decomposes by the action of an acid to leave,

in General Formula (1), R 1 represents a hydrogen atom or an organic group, R 2 represents a tertiary alkyl group, n represents a positive integer, and * represents a binding position, and
in General Formulae (X1) and (X2), * represents a binding position.

2. The active-light-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the resin (P) does not substantially include a repeating unit other than the repeating unit (a) in which the polar group is a carboxyl group and the repeating unit (b).

3. The active-light-sensitive or radiation-sensitive resin composition according to claim 2 , wherein the content of the repeating units (a1) with respect to all the repeating units of the resin (P) is 35% to 70% by mole.

4. The active-light-sensitive or radiation-sensitive resin composition according to claim 2 , wherein the repeating unit (b) is a repeating unit derived from a (meth)acrylic acid derivative monomer.

5. The active-light-sensitive or radiation-sensitive resin composition according to claim 2 , wherein the resin (P) contains only one kind of the repeating unit (b) as the repeating unit (b).

6. The active-light-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the resin (P) does not substantially include a repeating unit other than the repeating unit (a1) and the repeating unit (b).

7. The active-light-sensitive or radiation-sensitive resin composition according to claim 6 , wherein the content of the repeating units (a1) with respect to all the repeating units of the resin (P) is 35% to 70% by mole.

8. The active-light-sensitive or radiation-sensitive resin composition according to claim 6 , wherein the repeating unit (b) is a repeating unit derived from a (meth)acrylic acid derivative monomer.

9. The active-light-sensitive or radiation-sensitive resin composition according to claim 6 , wherein the resin (P) contains only one kind of the repeating unit (b) as the repeating unit (b).

10. The active-light-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the content of the repeating units (a1) with respect to all the repeating units of the resin (P) is 35% to 70% by mole.

11. The active-light-sensitive or radiation-sensitive resin composition according to claim 10 , wherein the repeating unit (b) is a repeating unit derived from a (meth)acrylic acid derivative monomer.

12. The active-light-sensitive or radiation-sensitive resin composition according to claim 10 , wherein the resin (P) contains only one kind of the repeating unit (b) as the repeating unit (b).

13. The active-light-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the repeating unit (b) is a repeating unit derived from a (meth)acrylic acid derivative monomer.

14. The active-light-sensitive or radiation-sensitive resin composition according to claim 13 , wherein the resin (P) contains only one kind of the repeating unit (b) as the repeating unit (b).

15. The active-light-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the resin (P) contains only one kind of the repeating unit (b) as the repeating unit (b).

16. The active-light-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the repeating unit (b) is a repeating unit represented by any one of the following General Formulae (b1) to (b7),

in General Formulae (b1) to (b7), R b1 's each independently represent a hydrogen atom or an organic group.

17. The active-light-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the solvent is a mixed solvent obtained by mixing a solvent containing a hydroxyl group and a solvent containing no hydroxyl group.

18. A pattern forming method comprising at least:
(i) a step of forming an active-light-sensitive or radiation-sensitive resin composition film on a substrate, using the active-light-sensitive or radiation-sensitive resin composition according to claim 1 ;
(ii) a step of irradiating the film with active light or radiation; and
(iii) a step of developing the film irradiated with active light or radiation using a developer.

19. The pattern forming method according to claim 18 , wherein the developer includes an organic solvent.

Assignees

• Fujifilm Corp

Inventors

• Goto Akiyoshi
• KOJIMA Masafumi
• Shirakawa Michihiro
• Kato Keita

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• G03F7/0397 Primary

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title

• G03F7/325

  Non-aqueous compositions · CPC title

• G03F7/039 Primary

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

• G03F7/16

  Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74) · CPC title