Sputtering apparatus, film deposition method, and control device

Patent metadata

Field	Value
Publication number	US-9991102-B2
Application number	US-201514948481-A
Country	US
Kind code	B2
Filing date	Nov 23, 2015
Priority date	Jun 25, 2010
Publication date	Jun 5, 2018
Grant date	Jun 5, 2018

Abstract

A sputtering apparatus according to one embodiment of the present invention includes a substrate holder, a cathode unit arranged at a position diagonally opposite to the substrate holder, a position sensor for detecting a rotational position of the substrate, and a holder rotation controller for adjusting a rotation speed of the substrate according to the detected rotational position. The holder rotation controller controls the rotation speed so that the rotation speed of the substrate when the cathode unit is located on a side in a first direction as an extending direction of a process target surface of the relief structure is lower than the rotation speed of the substrate when the cathode unit is located on a side in a second direction which is perpendicular to the first direction along the rotation of the substrate.

First claim

The invention claimed is:

1. A storage medium storing a computer-readable program which causes a computer to function as a control device for controlling a sputtering apparatus,
wherein the sputtering apparatus includes:
a substrate having a plurality of relief structures, each having four side surfaces that include two side surfaces parallel to a first direction, formed thereon;
a substrate holder configured to rotatably hold the substrate;
a target holder arranged at a position diagonally opposite to the substrate holder, and configured to support at least one sputtering target;
a position detecting means for detecting a rotational position of the two side surfaces of the relief structure of the substrate held on the substrate holder; and
a rotation driving means for controlling rotation of the substrate holder,

wherein the control device includes:
means for acquiring information on the rotational position of the two side surfaces of the relief structure of the substrate from the position detecting means;
means for generating a control signal to control the rotation driving means according to the acquired information on the rotational position of the two side surfaces of the relief structure of the substrate; and
means for transmitting the generated control signal to the rotation driving means, and

wherein the program executes a control of the rotation drive means by the control signal in such a manner that the rotation speed of the substrate when the sputtering target is located on a side in the first direction which is parallel to the two side surfaces of the relief structure and is parallel to an in-plane direction of the substrate is lower than the rotation speed of the substrate when the sputtering target is located on a side in a second direction which is perpendicular to the first direction and is parallel to the in-plane direction of the substrate.

2. A storage medium storing a computer-readable program which causes a computer to function as a control device for controlling a sputtering apparatus,
wherein the sputtering apparatus includes:
a substrate having a plurality of relief structures, each having four side surfaces that include two side surfaces parallel to a first direction, formed thereon;
a substrate holder configured to hold the substrate while discontinuously rotating the substrate;
a target holder arranged at a position diagonally opposite to the substrate holder, and configured to support at least one sputtering target;
a position detecting means for detecting a rotational position of the two side surfaces of the relief structure of the substrate held on the substrate holder; and
a rotation driving means for adjusting rotation stop time for the substrate according to the rotational position of the two side surfaces of the relief structure of the substrate detected by the position detecting means,

wherein the control device includes:
means for acquiring information on the rotational position of the two side surfaces of the relief structure of the substrate from the position detecting means;
means for generating a control signal to control the rotation driving means according to the acquired information on the rotational position of the two side surfaces of the relief structure of the substrate; and
means for transmitting the generated control signal to the rotation driving means, and

wherein the program executes a control of the rotation drive means by the control signal in such a manner that the rotation stop time for the substrate when the sputtering target is located on a side in the first direction which is parallel to the two side surfaces of the relief structure and is parallel to an in-plane direction of the substrate is longer than the rotation stop time for the substrate when the sputtering target is located on a side in a second direction which is perpendicular to the first direction and is parallel to the in-plane direction of the substrate.

3. A storage medium storing a computer-readable program which causes a computer to function as a control device for controlling a sputtering apparatus,
wherein the sputtering apparatus includes:
a substrate having a plurality of relief structures, each having four side surfaces that include two side surfaces parallel to a first direction, formed thereon;
a substrate holder configured to rotatably hold the substrate;
a target holder arranged at a position diagonally opposite to the substrate holder, and configured to support at least one sputtering target;
a position detecting means for detecting a rotational position of the two side surfaces of the relief structure of substrate held on the substrate holder; and
a power supply source configured to supply power to a cathode unit,

wherein the control device includes:
means for acquiring information on the rotational position of the two side surfaces of the relief structure of the substrate from the sputtering apparatus;
means for generating a control signal to control the supply power for the cathode unit according to the acquired information on the rotation position of the two side surfaces of the relief structure of the substrate; and
means for transmitting the generated control signal to the power supply source, and

wherein the program executes a control of the power supply source by the control signal in such a manner that the supply power for the cathode unit when the sputtering target is located on a side in the first direction which is parallel to the two side surfaces of the relief structure and is parallel to an in-plane direction of the substrate is greater than the supply power for the cathode unit when the sputtering target is located on a side in a second direction which is perpendicular to the first direction and is parallel to the in-plane direction of the substrate.

4. The storage medium according to claim 1 , wherein the relief structure is provided on the substrate so that one of the two side surfaces faces a notch or an orientation flat of the substrate, and
the means for generating the control signal is controlled so that a film is deposited uniformly on one of the two side surfaces which is on a side of the notch or the orientation flat and on another of the two side surfaces which is on an opposite side of the notch or the orientation flat.

5. The storage medium according to claim 2 , wherein the relief structure is provided on the substrate so that one of the two side surfaces faces a notch or an orientation flat of the substrate, and
the means for generating the control signal is controlled so that a film is deposited uniformly on one of the two side surfaces which is on a side of the notch or the orientation flat and on another of the two side surfaces which is on an opposite side of the notch or the orientation flat.

6. The storage medium according to claim 3 , wherein the relief structure is provided on the substrate so that one of the two side surfaces faces a notch or an orientation flat of the substrate, and
the means for generating the control signal is controlled so that a film is deposited uniformly on one of the two side surfaces which is on a side of the notch or the orientation flat and on another of the two side surfaces which is on an opposite side of the notch or the orientation flat.

Assignees

• Canon Anelva Corp

Inventors

• Tsunekawa Koji
• Suenaga Masahiro
• Konno Takeo

Classifications

• C23C14/542

  Controlling the film thickness or evaporation rate · CPC title

• H01J37/3435

  Target holders (includes backing plates and endblocks) · CPC title

• H01J37/32733

  Means for moving the material to be treated · CPC title

• C23C14/3464

  using more than one target (C23C14/56 takes precedence) · CPC title

• H01J2237/24578

  Spatial variables, e.g. position, distance · CPC title