Substrate cleaning apparatus and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-9978617-B2
Application number	US-201314422248-A
Country	US
Kind code	B2
Filing date	Aug 20, 2013
Priority date	Aug 20, 2012
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

The present invention relates to a substrate cleaning apparatus for performing scrub cleaning of a surface of a substrate by rotating both of the substrate and a roll cleaning member while keeping the roll cleaning member in contact with the surface of the substrate. The substrate cleaning apparatus includes a roll holder ( 42 ) configured to support and rotate a roll cleaning member ( 46 ), a vertical movement mechanism ( 60 ), having a vertically movable unit ( 58 ) vertically movable by actuation of an actuator ( 56 ) having a regulating device ( 62 ), configured to vertically move the roll holder ( 42 ) coupled to the vertically movable unit ( 58 ) so that the roll cleaning member ( 46 ) applies a roll load to the substrate W at the time of cleaning the substrate, a load cell ( 54 ) provided between the vertically movable unit ( 58 ) of the vertical movement mechanism ( 60 ) and the roll holder ( 42 ) and configured to measure the roll load, and a controller ( 66 ) configured to perform feedback control of the roll load through the regulating device ( 62 ) of the actuator ( 56 ) based on a measured value of the load cell ( 54 ).

First claim

The invention claimed is:

1. A substrate cleaning apparatus for cleaning a substrate, comprising:
a roll holder configured to support a horizontally elongated roll cleaning member and rotate the roll cleaning member;
a vertical movement mechanism, having a vertically movable unit vertically movable by actuation of an actuator having a regulating device, configured to vertically move the roll holder coupled to the vertically movable unit so that the roll cleaning member applies a predetermined roll load to the substrate at the time of cleaning the substrate;
a load cell provided between the vertically movable unit of the vertical movement mechanism and the roll holder and configured to measure the roll load;
a controller configured to perform feedback control of the roll load through the regulating device of the actuator based on a measured value of the load cell; and
a tilting mechanism provided between the vertically movable unit of the vertical movement mechanism and the roll holder and configured to tilt the roll holder,
wherein the load cell is provided at a substantially central area along a longitudinal direction of the roll holder and is coupled to the vertically movable unit of the vertical movement mechanism.

2. The substrate cleaning apparatus according to claim 1 , wherein the controller is configured to start the feedback control of the roll load from when the roll load is applied to the substrate.

3. The substrate cleaning apparatus according to claim 2 , wherein an electropneumatic regulator is used as the regulating device, and the controller arbitrarily sets, for each preset roll load, an operation amount of the electropneumatic regulator before starting the feedback control of the roll load applied to the substrate.

4. The substrate cleaning apparatus according to claim 1 , wherein the controller arbitrarily sets, for each preset roll load, timing to start the feedback control of the roll load applied to the substrate.

5. A substrate processing apparatus having a substrate cleaning apparatus according to claim 1 .

6. The substrate cleaning apparatus according to claim 1 , wherein the vertically movable unit of the vertical movement mechanism comprises a vertically movable shaft vertically movable by actuation of the actuator.

7. The substrate cleaning apparatus according to claim 1 , wherein the tilt mechanism is configured to tilt the roll holder about an axis that is provided at a substantially central area along a longitudinal direction of the roll holder.

8. The substrate cleaning apparatus according to claim 1 , wherein the tilt mechanism comprises a casing and a shaft rotatably coupled to the casing.

9. The substrate cleaning apparatus according to claim 8 , wherein the casing is fixed to the vertically movable unit and the shaft is fixed to the roll holder.

10. The substrate cleaning apparatus according to claim 1 , wherein the roll holder is coupled to the vertically movable unit at the substantially central area along the longitudinal direction of the roll holder.

11. The substrate cleaning apparatus according to claim 1 , wherein the roll holder is coupled to the vertically movable unit at the substantially central area along the longitudinal direction of the roll holder such that a center of gravity of the roll holder passes through a center of the load cell.

12. A substrate cleaning apparatus for cleaning a substrate, comprising:
a roll holder configured to support a horizontally elongated roll cleaning member and rotate the roll cleaning member;
a vertical movement mechanism, having a vertically movable unit vertically movable by actuation of an actuator having a regulating device, configured to vertically move the roll holder coupled to the vertically movable unit so that the roll cleaning member applies a predetermined roll load to the substrate at the time of cleaning the substrate;
a load cell provided between the vertically movable unit of the vertical movement mechanism and the roll holder and configured to measure the roll load;
a controller configured to perform feedback control of the roll load through the regulating device of the actuator based on a measured value of the load cell; and
a tilting mechanism provided between the vertically movable unit of the vertical movement mechanism and the roll holder and configured to tilt the roll holder,
wherein the tilt mechanism is provided at a substantially central area along a longitudinal direction of the roll holder.

Assignees

• Ebara Corp

Inventors

• Tanaka Hideaki

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P70/60

  Cleaning only by mechanical processes · CPC title

• H10P70/00

  Cleaning of wafers, substrates or parts of devices · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title