Growth of Nanowires
US-2024344223-A1 · Oct 17, 2024 · US
US9970119B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9970119-B2 |
| Application number | US-201415031598-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 2, 2014 |
| Priority date | Oct 25, 2013 |
| Publication date | May 15, 2018 |
| Grant date | May 15, 2018 |
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In one aspect, the present invention provides a curved grating structure manufacturing method which comprises: a grating forming step of forming, in one surface of a grating-forming workpiece, a grating region in which a plurality of members mutually having the same shape are periodically provided; a stress layer forming step of forming a stress layer capable of generating stress, on a grating plane-defining surface of the grating region; a boding step of bonding a support substrate to the stress layer; a polishing step of polishing the other surface of the grating-forming workpiece on a side opposite to the one surface having the support substrate bonded thereto; and a peeling step of peeling off the support substrate from the stress layer, wherein the polishing step includes performing the polishing to allow the grating-forming workpiece to be curved by a stress arising from the stress layer, after the peeling step.
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing a curved grating structure, comprising: a grating forming step of forming, in one surface of a grating-forming workpiece, a grating region in which a plurality of members mutually having a same shape are periodically provided; a stress layer forming step of forming a stress layer capable of generating stress, on a grating plane-defining surface of the grating region; a boding step of bonding a support substrate to the stress layer; a polishing step of polishing the other surface of the grating-forming workpiece on a side opposite to the one surface having the support substrate bonded thereto; and a peeling step of peeling off the support substrate from the stress layer, wherein the polishing step is configured to perform the polishing to allow the grating-forming workpiece to be curved by a stress arising from the stress layer, after the peeling step. 2. The method as recited in claim 1 , which comprises, between the polishing step and the peeling step, a slitting step of forming a slit from the other surface of the grating-forming workpiece in a normal direction with respect to the other surface, until reaching a depth equal to or greater than a total thickness of the grating-forming workpiece and the stress layer, to thereby form a section surrounded by the slit, in the grating-forming workpiece. 3. The method as recited in claim 2 , wherein the slitting step is configured to form the section surrounded by the slit, plurally. 4. The method as recited in claim 1 , wherein the grating forming step is configured to form the grating region by forming a recess, and wherein the method comprises, between the grating forming step and the stress layer forming step, an insulation layer forming step of forming an insulation layer on a surface of the recess in the grating-forming workpiece, except for a surface of a bottom of the recess, an electroforming step of applying voltage across the grating-forming workpiece to perform an electroforming process to fill the recess with a metal, and an insulation layer removing step of removing the insulation layer formed on the surface of the recess in the insulation layer forming step, at least in a region intervening between the grating-forming workpiece and the metal filled in the electroforming step. 5. The method as recited in claim 1 , wherein the bonding step is configured to bond the stress layer and the support substrate together through a tacky adhesive layer, and the peeling step is configured to lower a tacky adhesive force of the tacky adhesive layer by heating or by ultraviolet irradiation via the support substrate. 6. A curved grating structure manufactured by the method as recited in claim 1 . 7. A grating unit comprising a plurality of grating structures arranged to form one grating plane, wherein at least one of the plurality of grating structures is composed of the curved grating structure as recited in claim 6 . 8. An X-ray imaging device comprising: an X-ray source for radiating X-rays; a Talbot interferometer or Talbot-Lau interferometer configured to be irradiated with X-rays radiated from the X-ray source; and an X-ray imaging element for imaging X-rays from the Talbot interferometer or Talbot-Lau interferometer, wherein the Talbot interferometer or Talbot-Lau interferometer comprises the curved grating structure as recited in claim 6 .
Electroplating of selected surface areas · CPC title
Details of radiation-measuring instruments · CPC title
using diffraction, refraction or reflection, e.g. monochromators (G21K1/10, G21K7/00 take precedence) · CPC title
Electroplating characterised by the article coated · CPC title
for use with ultraviolet radiation or X-rays · CPC title
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