Power module substrate, power module substrate with heat sink, and power module
US-9480144-B2 · Oct 25, 2016 · US
US9969654B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9969654-B2 |
| Application number | US-201514601520-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 21, 2015 |
| Priority date | Jan 24, 2014 |
| Publication date | May 15, 2018 |
| Grant date | May 15, 2018 |
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A means for attaching a metallic component to a non-metallic component using a compliant material having thermal properties intermediate those of the metallic component to a non-metallic component is provided. The method can accommodate CTE mismatches and wear-type problems common to many assemblies of dissimilar materials. In particular, the method provides a sufficient wear surface to accommodate relative motion and provide a durable wear surface that does not excessively wear/gall/mico-weld itself together and provides the necessary damping and motion for proper operation in aeronautical applications.
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What is claimed is: 1. A method of bonding a metallic component to a ceramic matrix composite comprising the steps of: applying a compliant material between the metallic component and the ceramic matrix composite to create an assembly, the compliant material having a coefficient of thermal expansion intermediate those of the metallic component and the ceramic matrix composite; heating the assembly to a first temperature suitable to temporarily liquefy the compliant material without melting the metallic component; and bonding the metallic component and the ceramic matrix composite by maintaining the assembly at a bonding temperature until the compliant material forms a solid bonding layer, wherein the bonding layer has a higher melting point than the first temperature and further wherein during the bonding step the compliant material diffuses into both the metallic component and into the ceramic matrix composite. 2. The method of claim 1 wherein: the compliant material is applied by a process selected from the group consisting of foil layup, powder application, plating, chemical vapor deposition, physical vapor deposition, cold spraying, and plasma spraying. 3. The method of claim 1 wherein: the heating step is accomplished by a process selected from the group consisting of radiation, conduction, radio-frequency induction, resistance, laser, and infrared heating. 4. The method of claim 1 wherein: during the bonding step the compliant material is precipitation hardened by holding the assembly at a hardening temperature lower than the first temperature for a specified period of time. 5. The method of claim 1 wherein: the compliant material consists essentially of a single homogenous interlayer. 6. The method of claim 5 wherein: the interlayer is a selected from the group consisting of a foil, a powder and a paste. 7. The method of claim 6 wherein: the interlayer is a foil of aluminum. 8. The method of claim 1 wherein the compliant material comprises a multi-layer interlayer, the method comprising the additional step of: homogenizing the compliant material that forms the bond by maintaining the assembly at a suitable second temperature. 9. The method of claim 8 wherein: the second temperature is different from the first temperature. 10. The method of claim 3 wherein: the metallic component is a platform and the ceramic matrix composite is a vane or fin structure mountable to the platform. 11. A method of joining a metallic component to a non-metallic component made of ceramic matrix composite material, the method comprising the steps of: providing a compliant material having a coefficient of thermal expansion intermediate the coefficient of thermal expansions of the metallic component and the non-metallic component; placing the compliant material between the metallic component and the non-metallic component to create an assembly; liquefying the compliant material at a first temperature; and bonding the metallic component to the non-metallic component by maintaining the assembly at a temperature at which the compliant material forms a diffusion bond with both the metallic component and the non-metallic component, wherein the metallic component is a platform and the non-metallic component is a vane or fin structure mountable to the platform.
one layer being aluminium, magnesium or beryllium · CPC title
with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas · CPC title
by means of a rolling mill · CPC title
Isostatic pressure welding · CPC title
by means of a press {; Diffusion bonding} · CPC title
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