Vacuum process chamber component and methods of making

Patent metadata

Field	Value
Publication number	US-9969022-B2
Application number	US-89221910-A
Country	US
Kind code	B2
Filing date	Sep 28, 2010
Priority date	Sep 28, 2010
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A vacuum process chamber component comprising two separate pieces with an o-ring between the pieces and solder bonded together is described. The component may be an electrostatic chuck comprising a ceramic electrostatic puck and a metal baseplate with at least one o-ring therebetween and joined by a solder bond is described. Methods of making and using vacuum process chamber component are also described.

First claim

What is claimed is:

1. A component for use a in a vacuum process chamber comprising:
a first piece comprising a first material having a first coefficient of thermal expansion, the first piece having a receiving surface to receive a substrate, the receiving surface comprising a plurality of raised mesas formed by intersecting radial grooves that terminate in an inner circular groove;
a second piece comprising a second material having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, the second piece including a peripheral ledge having a plurality of holes therethrough;
at least one o-ring compressed between the first piece and the second piece, the at least one o-ring defining an outer radial portion and an inner radial portion of the component; and
a solder bond joining the first piece to the second piece to provide a hermetic seal between the first piece and second piece such that when one of the outer radial portion and inner radial portion is under vacuum pressure and the other of the outer radial portion and inner radial portion is under atmospheric pressure, the hermetic seal prevents a leak between the outer radial portion and the inner radial portion, and wherein the o-ring is spaced about 1 mm to about 5 mm from an inner portion of the solder bond.

2. The component of claim 1 , wherein both the first piece and the second piece are metal.

3. The component of claim 1 , wherein one of the first piece and the second piece is metal and the other of the first piece and the second piece is ceramic.

4. The component of claim 1 , wherein the at least one o-ring is positioned within a groove in one or more of the first piece and the second piece.

5. The component of claim 1 , wherein the first piece is an electrostatic puck comprising a ceramic body and the second piece is a baseplate comprising a metal body.

6. The component of claim 1 , wherein the at least one o-ring is compressible.

7. The component of claim 6 , wherein the at least one o-ring is made of a perfluoropolymer.

8. The component of claim 6 , wherein the at least one o-ring is made from a soft metal.

9. The component of claim 6 , wherein the at least one o-ring in a compressed state has a thickness about 75% of the thickness when in an uncompressed thickness.

10. The component of claim 5 , further comprising at least one electrical connection extending through the baseplate and into the electrostatic puck, the at least one electrical connection surrounded by at least one o-ring.

11. The component according to claim 1 , wherein the solder bond is formed using electrically ignited foil material.

12. A method of making a vacuum chamber component comprising:
providing a first piece and a second piece, the first piece comprising a first material having a first coefficient of thermal expansion and a receiving surface to receive a substrate, the receiving surface comprising a plurality of raised mesas formed by intersecting radial grooves that terminate in an inner circular groove, the second piece comprising a second material having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, the second piece including a peripheral ledge having a plurality of holes therethrough;
disposing a reactive foil and at least one o-ring between the first piece and the second piece, the at least one o-ring defining an outer portion and an inner portion; and
igniting the reactive foil to locally heat the reactive foil and form a low temperature solder bond between the first piece and the second piece with the o-ring therebetween providing a hermetic seal between the first piece and the second piece such that when one of the outer portion and inner portion is under vacuum pressure and the other of the outer portion and inner portion is under atmospheric pressure, the hermetic seal prevents a leak between the outer portion and the inner portion the o-ring spaced about 1 mm to about 5mm from the inner portion of the solder bond.

13. The method of claim 12 , further comprising providing a solder wetted thin layer on one or both of the first piece and the second piece prior to igniting the reactive foil, the solder wetted thin layer adjacent the reactive foil and at least one o-ring.

14. The method of claim 12 , further comprising pressing the first piece and the second piece together to cause the at least one o-ring to become compressed to a thickness about 75% of an uncompressed thickness.

15. The method of claim 12 , wherein the solder bond between the first piece and the second piece is formed without raising the temperature of the first piece or the second piece.

16. The method of claim 12 , wherein igniting the reactive foil occurs at a temperature less than about 50 ° C.

17. The method of claim 12 , wherein the solder bond forms in less than about two seconds.

18. The method of claim 12 , wherein an electrical potential ignites the reactive foil.

19. The method of claim 18 , wherein the electrical potential is about 9V DC.

20. A component comprising at least one o-ring between a first piece and a second piece, the component press fitted to compress the at least one o-ring and interbonded by a solder bond providing a hermetic seal therebetween, and at least one electrical connection extending through the second piece and into the first piece, the at least one electrical connection surrounded by the at least one o-ring, wherein the o-ring is spaced about 1 mm to about 5 mm from an inner portion of the solder bond, and wherein the first piece comprises a first material having a first coefficient of thermal expansion, the first piece having a receiving surface comprising a plurality of raised mesas formed by intersecting radial grooves, and the second piece comprising a second material having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, the second piece including a peripheral ledge with a plurality of holes therethrough.

21. The component of claim 20 , wherein the at least one o-ring defines an outer portion and an inner portion of the component and the solder bond providing a hermetic seal between the first piece and second piece such that when one of the outer portion and inner portion is under vacuum pressure and the other of the outer portion and inner portion is under atmospheric pressure, the hermetic seal prevents a leak between the outer portion and the inner portion.

22. The component of claim 20 , wherein the solder bond is formed by igniting a reactive foil between the first piece and the second piece.

Assignees

• Parkhe Vijay D
• Applied Materials Inc

Inventors

• Parkhe Vijay D

Classifications

• B23K2103/05

  Stainless steel · CPC title

• B23K2101/20

  Tools · CPC title

• F16B5/08

  by means of welds or the like (welding B23K) · CPC title

• B23K2103/12

  Copper or alloys thereof · CPC title

• B23K2103/10

  Aluminium or alloys thereof · CPC title