Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon

Patent metadata

Field	Value
Publication number	US-9967974-B2
Application number	US-201414777670-A
Country	US
Kind code	B2
Filing date	Apr 17, 2014
Priority date	Apr 26, 2013
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

First claim

The invention claimed is:

1. A composition for forming a conductive pattern by electromagnetic irradiation, comprising:
a polymer resin; and
a non-conductive metal compound containing a first metal and a second metal,
wherein the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contain at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other, and
a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and
wherein a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation; and
wherein the composition exhibits reflectivity of 25% or less with respect to a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm; and
wherein the metal core is formed by irradiating a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm at an average power of 5 to 20 W.

2. The composition of claim 1 , wherein the non-conductive metal compound has a space group of R 3 m or P6 3 /mmc.

3. The composition of claim 1 , wherein the non-conductive metal compound is a compound containing the first and second metals and X, wherein X is oxygen, nitrogen, or sulfur, and the non-conductive metal compound has a three-dimensional structure containing a plurality of the first layers in which at least one metal of the first and second metals and atoms of X form edge-shared octahedrons arranged in the two-dimensionally connected structure, and
a second layer that contains a metal different from that of the first layer, in which the metal connects the two-dimensional structure of the octahedrons to each other between the neighboring first layers.

4. The composition of claim 1 , wherein the non-conductive metal compound includes one or more compounds selected from the group consisting of CuCrO 2 , NiCrO 2 , AgCrO 2 , CuMoO 2 , NiMoO 2 , AgMoO 2 , NiMnO 2 , AgMnO 2 , NiFeO 2 , AgFeO 2 , CuWO 2 , AgWO 2 , NiWO 2 , AgSnO 2 , NiSnO 2 and CuSnO 2 .

5. The composition of claim 1 , wherein the polymer resin includes a thermosetting resin or a thermoplastic resin.

6. The composition of claim 5 , wherein the polymer resin includes one or more selected from the group consisting of an ABS resin, a polyalkylene terephthalate resin, a polycarbonate resin, a polypropylene resin, and a polyphthalamide resin.

7. The composition of claim 1 , wherein the non-conductive metal compound is included in an amount of 1 to 10% by weight, with respect to the total composition.

8. The composition of claim 1 , further comprising one or more additives selected from the group consisting of a heat stabilizer, a UV stabilizer, a flame retardant, a lubricant, an antioxidant, an inorganic filler, a color additive, an impact modifier, and a functional modifier.

9. A method for forming a conductive pattern by electromagnetic irradiation, comprising the steps of:
molding the composition of claim 1 to a resin product or applying it to another product to form a resin layer;
irradiating a region of the resin product or the resin layer with electromagnetic irradiation to generate metal cores containing the first or second metal or the ion thereof from the non-conductive metal compound; and
chemically reducing or plating the region containing the metal cores to form a conductive metal layer.

10. The method of claim 9 , wherein the electromagnetic irradiation is produced by a laser having a wavelength of 1000 nm to 1200 nm at an average power of 5 to 20 W.

11. The method of claim 9 , wherein in the irradiating step, a part of the non-conductive metal compound is exposed on the surface of the region of the resin product or the resin layer, and the metal cores are generated therefrom, thereby forming an adhesion-activated surface that is activated to have higher adhesion.

12. The method of claim 11 , wherein the conductive metal layer is formed on the adhesion-activated surface by chemical reduction of the first or second metal ion contained in the metal core or by electroless plating thereof.

13. The method of claim 9 , wherein in the reduction or plating step, the region containing the metal cores is treated with an acidic or basic solution containing a reducing agent.

14. The method of claim 13 , wherein the reducing agent includes one or more compounds selected from the group consisting of formaldehyde, hypophosphite, dimethylamino borane (DMAB), diethylamino borane (DEAB) and hydrazine.

15. A resin structure having a conductive pattern, comprising:
a composition of claim 1 having an adhesion-activated surface comprising the metal cores containing the first or second metal or the ion thereof which is exposed on the surface of a region of the polymer resin; and
a conductive metal layer formed on the adhesion-activated surface.

16. The resin structure of claim 15 , wherein the region containing the adhesion-activated surface and the conductive metal layer is the region of the polymer resin exposed to the laser irradiation.

Assignees

• Lg Chemical Ltd

Inventors

• Park Chee-Sung
• Park Cheol-Hee
• Jun Shin Hee
• Jung Sang Yun
• Jeong Han Nah

Classifications

• C08J2300/24

  Thermosetting resins · CPC title

• B22F9/24

  starting from liquid metal compounds, e.g. solutions · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K2201/09118

  Moulded substrate · CPC title

• C23C18/1612

  through irradiation means · CPC title