COMPOSITION FOR FORMING CONDUCTIVE PATTERN AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN THEREON (As Amended)

Patent metadata

Field	Value
Publication number	US-2016234933-A1
Application number	US-201415023506-A
Country	US
Kind code	A1
Filing date	Nov 24, 2014
Priority date	Nov 25, 2013
Publication date	Aug 11, 2016
Grant date	—

Abstract

The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern on a variety of polymeric resin products or resin layers by a simplified process, while imparting excellent flame retardancy to the resin products or resin layers, and a resin structure having the conductive pattern obtained using the composition. The composition for forming a conductive pattern includes: a polymer resin; a non-conductive metal compound including a first metal element and a second metal element, having a R 3 m or P6 3 /mmc space group in crystal structure; and a flame retardant, wherein a metal nucleus including the first metal element, the second metal element or an ion thereof is formed from the non-conductive metal compound by the electromagnetic irradiation.

First claim

1 . A composition for forming a conductive pattern by electromagnetic irradiation, comprising:
a polymer resin; a non-conductive metal compound including a first metal element and a second metal element, having a R 3 m or P6 3 /mmc space group in crystal structure; and a flame retardant, wherein a metal nucleus including the first metal element, the second metal element or an ion thereof is formed from the non-conductive metal compound by the electromagnetic irradiation.

2 . The composition of claim 1 , wherein the non-conductive metal compound includes one or more compounds selected from the group consisting of CuCrO 2 , NiCrO 2 , AgCrO 2 , CuMoO 2 , NiMoO 2 , AgMoO 2 , NiMnO 2 , AgMnO 2 , NiFeO 2 , AgFeO 2 , CuWO 2 , AgWO 2 , NiWO 2 , AgSnO 2 , NiSnO 2 and CuSnO 2 .

3 . The composition of claim 1 , wherein it exhibits reflectivity of 25% or less with respect to a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm.

4 . The composition of claim 1 , wherein the metal nucleus is formed by irradiating a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm at an average power of 5 to 20 W.

5 . The composition of claim 1 , wherein the polymer resin includes a thermosetting resin or a thermoplastic resin.

6 . The composition of claim 5 , wherein the polymer resin includes one or more selected from the group consisting of an ABS resin, a polyalkylene terephthalate resin, a polycarbonate resin, a polypropylene resin, and a polyphthalamide resin.

7 . The composition of claim 1 , wherein the non-conductive metal compound is included in an amount of 0.1 to 10 wt %, with respect to the total composition.

8 . The composition of claim 1 , wherein the flame retardant includes a phosphorus-containing organic flame retardant or an inorganic flame retardant.

9 . The composition of claim 8 , wherein the phosphorus-containing organic flame retardant includes one or more selected from the group consisting of trialkyl phosphate, alkyldiaryl phosphate, tricryl phosphate and resorcinol bisphenyl phosphate.

10 . The composition of claim 8 , wherein the inorganic flame retardant includes one or more selected from the group consisting of metal hydrides, antimony oxide and metal sulfonates.

11 . The composition of claim 1 , wherein the flame retardant is included in an amount of 0.1 to 20 wt %, with respect to the total composition.

12 . The composition of claim 1 , further comprising one or more additives selected from the group consisting of a heat stabilizer, a UV stabilizer, a lubricant, an antioxidant, an inorganic filler, a colorant, an impact modifier, and a functional modifier

13 . The composition of claim 12 , wherein the flame retardant includes a phosphorus-containing organic flame retardant, and the inorganic filler or the impact modifier is included as the additive.

14 . A resin structure having a conductive pattern, comprising
a polymeric resin substrate; a non-conductive metal compound including a first metal element and a second metal element, having a R 3 m or P6 3 /mmc space group in crystal structure, and dispersed in the polymeric resin substrate; a flame retardant dispersed in the polymeric resin substrate; an adhesion-activated surface including a metal nucleus including a first or a second metal or an ion thereof exposed on a surface of a predetermined region of the polymeric resin substrate; and a conductive metal layer formed on the adhesion-activated surface.

15 . The resin structure of claim 14 , wherein the predetermined region on which the adhesion-activated surface and the conductive metal layer are formed corresponds to a region of the polymeric resin substrate to which an electromagnetic wave is irradiated.

16 . The resin structure of claim 14 , wherein it exhibits a flame retardant grade of UV 94-V0 or V1 (thickness (t) is 0.6 to 1.6 mm).

17 . The resin structure of claim 14 , wherein the conductive metal layer is formed on the polymeric resin substrate by adhesion at which a delamination area of the metal layer is 0% (ISO Class 0 grade), or more than 0% to 5% or less (ISO Class 1 grade), of an area of a target metal layer under test, when tested according to ISO 2409 standard.

Assignees

• Lg Chemical Ltd

Inventors

• Jun Shin Hee
• Park Chee-Sung
• Kim Jae Hyun
• Jung Sang Yun
• Park Cheol-Hee
• Jeong Han Nah

Classifications

• H05K3/0055

  After-treatment, e.g. cleaning or desmearing of holes · CPC title

• H05K2201/0158

  Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP] · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title