Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon

Patent metadata

Field	Value
Publication number	US-9668342-B2
Application number	US-201414895143-A
Country	US
Kind code	B2
Filing date	Sep 22, 2014
Priority date	Sep 27, 2013
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern reducing deterioration of mechanical-physical properties and having excellent adhesion strength onto a variety of polymeric resin products or resin layers, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming a conductive pattern includes a polymer resin; and non-conductive metal compound particles including a first metal element and a second metal element, having a R 3 m or P6 3 /mmc space group in crystal structure, and having a particle size of 0.1 to 20 μm, wherein a metal nuclei including the first metal or the second metal element or an ion thereof is formed from the non-conductive metal compound particles by electromagnetic irradiation.

First claim

The invention claimed is:

1. A composition for forming a conductive pattern by electromagnetic irradiation, comprising:
a polymer resin; and
non-conductive metal compound particles including a first metal element and a second metal element, having a R 3 m or P6 3 /mmc space group in crystal structure, and having a particle size of 0.1 to 20 μm,
wherein a metal nuclei including the first metal, the second metal element or an ion thereof is formed from the non-conductive metal compound particles by electromagnetic irradiation.

2. The composition of claim 1 , wherein the non-conductive metal compound particles include one or more compounds selected from the group consisting of CuCrO 2 , NiCrO 2 , AgCrO 2 , CuMoO 2 , NiMoO 2 , AgMoO 2 , NiMnO 2 , AgMnO 2 , NiFeO 2 , AgFeO 2 , CuWO 2 , AgWO 2 , NiWO 2 , AgSnO 2 , NiSnO 2 and CuSnO 2 .

3. The composition of claim 1 , wherein it exhibits reflectivity of 25% or less with respect to a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm.

4. The composition of claim 1 , wherein the metal nuclei is formed by irradiating a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm at an average power of 5 to 20 W.

5. The composition of claim 1 , wherein the polymer resin includes a thermosetting resin or a thermoplastic resin.

6. The composition of claim 5 , wherein the polymer resin includes one or more selected from the group consisting of an ABS resin, a polyalkylene terephthalate resin, a polycarbonate resin, a polypropylene resin, and a polyphthalamide resin.

7. The composition of claim 1 , wherein the non-conductive metal compound particles are included in an amount of 0.5 to 7 wt %, with respect to the total composition.

8. The composition of claim 1 , further comprising one or more additives selected from the group consisting of a heat stabilizer, a UV stabilizer, a flame retardant, a lubricant, an antioxidant, an inorganic filler, a colorant, an impact modifier, and a functional modifier.

9. A method for forming a conductive pattern by direct electromagnetic irradiation comprising:
molding the composition for forming a conductive pattern of claim 1 to a resin product or applying the composition to another product so as to form a resin layer;
irradiating an electromagnetic wave to a predetermined region of the resin product or the resin layer so as to generate a metal nuclei including a first, a second metal or an ion thereof from non-conductive metal compound particles; and
chemically reducing or plating the region in which the metal nuclei is generated so as to form a conductive metal layer.

10. The method of claim 9 , wherein in the generating of the metal nuclei, a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm is irradiated at an average power of 5 to 20 W.

11. The method of claim 9 , wherein in the generating of the metal nuclei, a part of the non-conductive metal compound particles is exposed on a surface of the predetermined region of the resin product or the resin layer to generate the metal nuclei therefrom, and an adhesion-activated surface activated so as to have higher adhesion is formed.

12. The method of claim 11 , wherein the conductive metal layer is formed on the adhesion-activated surface by electroless plating.

13. A resin structure having a conductive pattern, comprising
a polymeric resin substrate;
non-conductive metal compound particles including a first metal element and a second metal element, having a R 3 m or P6 3 /mmc space group in crystal structure, having a particle size of 0.1 to 20 μm, and dispersed in the polymeric resin substrate;
an adhesion-activated surface including a metal nuclei including a first or a second metal or an ion thereof exposed on a surface of a predetermined region of the polymeric resin substrate; and
a conductive metal layer formed on the adhesion-activated surface.

14. The resin structure of claim 13 , wherein the predetermined region on which the adhesion-activated surface and the conductive metal layer are formed corresponds to a region of the polymeric resin substrate to which an electromagnetic wave is irradiated.

15. The resin structure of claim 13 , wherein the conductive metal layer is formed on the polymeric resin substrate by adhesion at which a delamination area of a target metal layer under test is 0% (ISO Class 0), or more than 0% to 5% or less (ISO Class 1), of an area of the metal layer under the test according to standard ISO 2409.

16. The resin structure of claim 13 , wherein an impact strength measured by ASTM D256 is approximately 4.0 J/cm or more.

Assignees

• Lg Chemical Ltd

Inventors

• Jun Shin Hee
• Park Chee-Sung
• Kim Jae Hyun
• Jung Sang Yun
• Park Cheol-Hee

Classifications

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• H05K2203/107

  Using laser light · CPC title

• C23C18/161

  from plating step, e.g. inkjet · CPC title

• C23C18/1608

  from pretreatment step, i.e. selective pre-treatment · CPC title

• C23C18/1641

  Organic substrates, e.g. resin, plastic · CPC title