Stack die package

Patent metadata

Field	Value
Publication number	US-9966330-B2
Application number	US-201313829623-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 14, 2013
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

In one embodiment, a stack die package can include a lead frame and a first die including a gate and a source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. The gate and source are flip chip coupled to the lead frame. The stack die package can include a second die including a gate and a drain that are located on a first surface of the second die and a source that is located on a second surface of the second die that is opposite the first surface. The source of the second die is facing the drain of the first die.

First claim

What is claimed is:

1. A stack die package comprising:
a lead frame;
a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;
a second die comprising a gate and a drain that are located on a first surface of said second die and a source that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die;
a clip coupled to said lead frame and said drain of said second die; and
a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.

2. The stack die package of claim 1 , further comprising:
a second clip coupled to said lead frame and said source of said second die.

3. The stack die package of claim 1 , further comprising:
a second clip coupled to said lead frame and said drain of said first die.

4. The stack die package of claim 1 , further comprising:
a second clip coupled to said lead frame and said gate of said second die.

5. The stack die package of claim 4 , further comprising:
a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.

6. The stack die package of claim 4 , further comprising:
a third clip coupled to said lead frame and said source of said second die.

7. The stack die package of claim 4 , further comprising:
a third clip coupled to said lead frame and said drain of said first die.

8. A stack die package comprising:
a lead frame;
a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;
a second die comprising a gate and a source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die;
a clip coupled to said lead frame and said drain of said second die; and
a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.

9. The stack die package of claim 8 , further comprising:
a second clip coupled to said lead frame and said source of said second die.

10. The stack die package of claim 8 , further comprising:
a second clip coupled to said lead frame and said drain of said first die.

11. The stack die package of claim 8 , further comprising:
a second clip coupled to said lead frame and said gate of said second die.

12. The stack die package of claim 11 , further comprising:
a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.

13. The stack die package of claim 11 , further comprising:
a third clip coupled to said lead frame and said source of said second die.

14. The stack die package of claim 11 , further comprising:
a third clip coupled to said lead frame and said drain of said first die.

15. A stack die package comprising:
a lead frame;
a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;
a second die comprising a gate and a drain that are located on a first surface of said second die and a source that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die, said second die comprising Laterally Diffused Metal Oxide Semiconductor (LDMOS) technology;
a clip coupled to said lead frame and said drain of said second die; and
a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.

16. The stack die package of claim 15 , further comprising:
a second clip coupled to said lead frame and said source of said second die.

17. The stack die package of claim 15 , further comprising:
a second clip coupled to said lead frame and said drain of said first die.

18. The stack die package of claim 15 , further comprising:
a second clip coupled to said lead frame and said gate of said second die.

19. The stack die package of claim 18 , further comprising:
a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.

20. The stack die package of claim 18 , further comprising:
a third clip coupled to said lead frame and said source of said second die.

Assignees

• Vishay Siliconix

Inventors

• Terrill Kyle
• Kuo Frank
• Mao Sen

Classifications

• H10W72/07653

  changes in shapes · CPC title

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title