Method for fabricating stack die package
US-10546840-B2 · Jan 28, 2020 · US
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Mao Sen patents
Mao Sen is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mao Sen |
| Total patents | 7 |
| First publication | Jan 6, 2015 |
| Latest publication | Jan 28, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Stack die package
US-9966330-B2 · May 8, 2018 · US
Method for fabricating stack die package
US-2017162403-A1 · Jun 8, 2017 · US
Method for fabricating stack die package
US-9589929-B2 · Mar 7, 2017 · US
Complete power management system implemented in a single surface mount package
US-2015331438-A1 · Nov 19, 2015 · US
Complete power management system implemented in a single surface mount package
US-9093359-B2 · Jul 28, 2015 · US
Complete power management system implemented in a single surface mount package
US-8928138-B2 · Jan 6, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Vishay Siliconix | 7 |
| Owyang King | 2 |
| Kasem Mohammed | 2 |
| Bai Yuming | 2 |
| Kuo Frank | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/00 | 7 |
| H10W72/884 | 7 |
| H10W90/756 | 6 |
| H10W90/736 | 6 |
| H10W90/00 | 6 |