Powered grid for plasma chamber

Patent metadata

Field	Value
Publication number	US-9966236-B2
Application number	US-201113161372-A
Country	US
Kind code	B2
Filing date	Jun 15, 2011
Priority date	Jun 15, 2011
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A plasma processing chamber and methods for operating the chamber are provided. An exemplary chamber includes an electrostatic chuck for receiving a substrate and a dielectric window connected to a top portion of the chamber. An inner side of dielectric window faces a plasma processing region that is above the electrostatic chuck and an outer side of the dielectric window is exterior to the plasma processing region. Inner and outer coils are disposed above the outer side of the dielectric window, and the inner and outer coils are connected to a first RF power source. A powered grid is disposed between the outer side of dielectric window and the inner and outer coils. The powered grid is connected to a second RF power source that is independent from the first RF power source.

First claim

What is claimed is:

1. A plasma processing chamber comprising:
an electrostatic chuck for receiving a substrate;
a dielectric window connected to a top portion of the plasma processing chamber, an inner side of dielectric window faces a plasma processing region that is above the electrostatic chuck and an outer side of the dielectric window is exterior to the plasma processing region;
inner and outer coils disposed above the outer side of the dielectric window, the inner and outer coils configured to be connected to a first radio frequency (RF) power source;
a powered grid disposed between the outer side of dielectric window and the inner and outer coils, the powered grid is configured to be connected to a second RF power source, and the powered grid is fabricated from a metallic material that is deposited and etched over a substrate layer,
wherein the substrate layer of the powered grid has a disk shape with a center opening and has a metallic ring defined from the metallic material disposed on and around the center opening of the substrate layer and further has a plurality of metallic spokes defined from the metallic material that is disposed on the substrate layer,
wherein all of the metallic spokes are connected to the metallic ring and extend from the metallic ring to a circumference of the powered grid,
wherein the powered grid is configured to be connected via a metal strap to the second RF power source that is independent from the first RF power source, wherein the metal strap is connected to the metallic ring at an edge of the center opening of the substrate layer of the powered grid and extends in a vertical direction with respect to a plane of the substrate layer, wherein the connection of the metal strap with the metallic ring at the edge of the center opening enables distribution of RF power from the second RF power source via the metal strap and the metallic ring and the metallic spokes across and out to the circumference of the powered grid,
wherein the substrate layer having the metallic material disposed thereon is located between the inner and outer coils and the dielectric window, wherein an underside of the substrate layer that is opposite the metallic material is in contact with the outer side of the dielectric window.

2. The plasma processing chamber of claim 1 , wherein the first RF power source is configured to provide transformer coupled plasma (TCP) power, wherein the metal strap is connected to the second RF power source via an impedance matching network.

3. The plasma processing chamber of claim 1 , wherein the substrate layer separates the powered grid from the dielectric window.

4. The plasma processing chamber of claim 1 , wherein the substrate layer is defined from a laminated dielectric material.

5. The plasma processing chamber of claim 1 , wherein power from the first RF power source is transferred into the plasma processing chamber through the powered grid.

6. The plasma processing chamber of claim 1 , wherein the substrate layer is flat and is between about 1 mm and 2 mm thick, and the metallic material of the powered grid is between about 0.075 mm and about 0.5 mm thick, as formed on the substrate layer.

7. The plasma processing chamber of claim 1 , wherein the second RF power source is configured to be set to a frequency of between about 1.5 MHz and about 2.5 MHz.

8. The plasma processing chamber of claim 1 , wherein area of an opening between any two consecutive ones of the metallic spokes varies along a radius of the powered grid.

9. The plasma processing chamber of claim 1 , wherein a frequency of the second RF power source is different from a frequency of the first RF power source.

10. The plasma processing chamber of claim 1 , wherein the metal strap extends in the vertical direction with respect to the center opening encircled by the inner coils.

11. A plasma processing chamber, comprising:
an electrostatic chuck for receiving a substrate;
a dielectric window connected to a top portion of the plasma processing chamber, an inner side of dielectric window faces a plasma processing region that is above the electrostatic chuck and an outer side of the dielectric window is exterior to the plasma processing region;
inner and outer coils disposed above the outer side of the dielectric window, the inner and outer coils configured to be connected to a first radio frequency (RF) power source;
a powered grid disposed between the outer side of dielectric window and the inner and outer coils, the powered grid is configured to be connected to a second RF power source, and the powered grid is fabricated from a metallic material that is deposited and etched over a substrate layer,
wherein the substrate layer of the powered grid has a disk shape with a center opening and has a metallic ring defined from the metallic material disposed on and around the center opening of the substrate layer and further has a plurality of metallic spokes defined from the metallic material that is disposed on the substrate layer,
wherein all of metallic spokes are connected to the metallic ring and extend from the metallic ring to a circumference of the powered grid,
wherein the powered grid is configured to be connected via a metal strap to the second RF power source that is independent from the first RF power source, wherein the metal strap is connected to the metallic ring at an edge of the center opening of the substrate layer of the powered grid and extends in a vertical direction with respect to a plane of the substrate layer, wherein the connection of the metal strap with the metallic ring at the edge of the center opening enables distribution of RF power from the second RF power source via the metal strap and the metallic ring and the metallic spokes across and out to the circumference of the powered grid,
wherein the second RF power source is adjustable in frequency to match a load of plasma in the plasma processing chamber, when in operation,
wherein the substrate layer having the metallic material disposed thereon is located between the inner and outer coils and the dielectric window, wherein an underside of the substrate layer that is opposite the metallic material is in contact with the outer side of the dielectric window.

12. The plasma processing chamber of claim 11 , wherein the first RF power source is configured to provide transformer coupled plasma (TCP) power, wherein the metal strap is connected to the second RF power source via an impedance matching network.

13. The plasma processing chamber of claim 11 , wherein the substrate layer separates the powered grid from the dielectric window.

14. The plasma processing chamber of claim 11 , wherein the substrate layer is defined from a laminated dielectric material.

15. The plasma processing chamber of claim 11 , wherein power from the first RF power source is transferred into the plasma processing chamber through the powered grid.

16. The plasma processing chamber of claim 11 , wherein the substrate layer is flat and is between about 1 mm and 2 mm thick, and the metallic material of the powered grid is between about 0.075 mm and about 0.5 mm thick, as formed on the substrate layer.

17. The plasma processing chamber of claim 11 , wherein the second RF power source is configured to be set to a frequency of between about 1.5 MHz and about 2.5 MHz.

18. The plasma processing chamber of claim 11 , wherein area of an opening between any two consecutive ones of the metallic spokes varies along a radius of the powered grid.

19. The plasma processing chamber of claim

Assignees

• Long Maolin
• Paterson Alex
• Marsh Richard
• Wu Ying
• Lam Res Corp

Inventors

• Long Maolin
• Paterson Alex
• Marsh Richard
• Wu Ying

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• H01J37/32697

  Electrostatic control · CPC title

• H01J37/32651 Primary

  Shields, e.g. dark space shields, Faraday shields · CPC title

• H01J37/321 Primary

  the radio frequency energy being inductively coupled to the plasma · CPC title

• H01L21/6831

  Electricity · mapped topic