Security mesh and method of making

Patent metadata

Field	Value
Publication number	US-9961765-B2
Application number	US-201615271800-A
Country	US
Kind code	B2
Filing date	Sep 21, 2016
Priority date	Dec 15, 2015
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

First claim

What is claimed is:

1. A security mesh comprising:
an alumina film having a first surface and an opposite second surface;
a plurality of metal through-wires extending from the first surface to the second surface, the through-wires terminating in respective opposite first and second ends with the first ends exposed to the first surface and the second ends exposed to the second surface;
first metal surface wires disposed on the first surface and connecting selected ones of the first ends in electric conducting communication with each other, and second surface wires disposed on the second surface and connecting selected ones of the second ends in electric conducting communication with each other, to provide a continuous undulating metal wire circuit extending through the alumina film,
wherein the security mesh is made by:
indenting an aluminum film having a first surface and an opposite second surface to form a pattern of indentations in the first surface, and anodizing the resulting indented aluminum film to convert the aluminum film to the alumina film having a first surface and an opposite second surface, and to form from the indentations through-holes extending through the resulting alumina film;
depositing a conductive metal onto the first surface of the alumina film to form a plurality of the through-wires in the through-holes and a first metal film on the first surface of the alumina film, the through-wires having respective first ends at or adjacent to the first surface of the alumina film and respective second ends at or adjacent to the second surface of the alumina film;
etching the first metal film to form on the first surface of the alumina film a plurality of the first metal surface wires connecting the first ends of selected through-wires to each other to thereby form a partially wired alumina film;
applying a second metal film to the second surface of the alumina film;
etching the second metal film to form on the second surface of the alumina film a plurality of the second metal surface wires connecting the second ends of selected through-wires to each other, the first and second surface wires being connected to the through-wires so as to form the continuous undulating wire circuit extending through the alumina film;
depositing the aluminum film on a conductive substrate with the first surface of the aluminum film exposed and the second surface facing the substrate, prior to anodizing the aluminum film;
applying a first photoresist layer to the first metal film and removing a patterned portion of the first photoresist layer to expose portions of the first metal film, etching the exposed portions of the first metal film to form the first metal surface wires, and then stripping the first photoresist layer from the first metal film; and
releasing the resulting partially wired alumina film from the conductive substrate to expose the second surface of the alumina film prior to applying the second metal film to the second surface of the alumina film.

2. A stacked security mesh comprising two or more of the security mesh of claim 1 superimposed over each other.

3. The security mesh of claim 1 wherein the metal comprises copper and further comprising a first protective layer disposed over the first metal surface wires and the first surface of the alumina film and coextensive with the first surface, and a second protective layer disposed over the second metal surface wires and the second surface of the alumina film and coextensive with the second surface.

4. The security mesh of claim 3 wherein the first protective layer and the second protective layer each comprise a cured epoxy layer.

5. A stacked security mesh comprising two or more of the security mesh of claim 3 superimposed over each other.

6. The security mesh of claim 3 wherein the alumina film has a thickness of from about 10 to about 100 nanometers.

7. The security mesh of claim 3 wherein the first protective layer comprises a first epoxy layer and the second protective layer comprises a second epoxy layer.

8. The security mesh of claim 1 wherein the alumina film has a thickness of from about 10 to about 100 nanometers.

9. The security mesh of claim 1 made by
applying a second photoresist layer to the second metal film and removing a patterned portion of the second photoresist layer to expose portions of the second metal film; and
etching the exposed portions of the second metal film to form the second metal surface wires and then stripping the second photoresist layer from the second metal film.

Assignees

• IBM

Inventors

• Arvin Charles L
• Erwin Brian M

Classifications

• H10W42/40

  protecting against tampering, e.g. unauthorised inspection or reverse engineering · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title