Solder joint material and method of manufacturing the same, soldering member and solar cell module

Patent metadata

Field	Value
Publication number	US-9960289-B2
Application number	US-201414497655-A
Country	US
Kind code	B2
Filing date	Sep 26, 2014
Priority date	Nov 29, 2013
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.

First claim

What is claimed is:

1. A solder joint material, comprising:
a copper-based metal material comprising mainly copper,
a surface-treated layer coextensive with an upper surface of the copper-based metal material and comprising an amorphous layer comprising oxygen and a metal with a higher oxygen affinity than the copper, the metal consisting of zinc; and
a Sn-based solder plating layer provided on the surface-treated layer.

2. The solder joint material according to claim 1 , wherein the solder joint material is plate-shaped, and wherein the solder joint material, further comprising:
another surface-treated layer coextensive with a lower surface of the copper-based metal material and comprising an amorphous layer comprising oxygen and a metal with a higher oxygen affinity than the copper, the metal consisting of zinc; and
another Sn-based solder plating layer provided on the other surface-treated layer of the copper-based metal material.

3. The solder joint material according to claim 1 , wherein the surface-treated layer further comprises a diffusion layer under the amorphous layer, and wherein the diffusion layer comprises copper and the metal with a higher oxygen affinity than the copper, or oxygen, copper, and the metal with a higher oxygen affinity than the copper.

4. The solder joint material according to claim 1 , wherein the surface-treated layer has a thickness of not less than 8 nm and not more than 300 nm.

5. A solar cell module, comprising the solder joint material according to claim 1 ; and a solar cell soldered by using the solder joint material.

6. The solder joint material according to claim 1 , wherein the surface-treated layer further comprises a diffusion layer under the amorphous layer, and wherein the diffusion layer consists of copper and a single elemental metal with a higher oxygen affinity than the copper, or oxygen, copper, and a single elemental metal with a higher oxygen affinity than the copper.

7. The solder joint material according to claim 1 , wherein the copper-based metal material consists of copper.

8. A solar cell module, comprising: a soldering member, including: a copper-based metal material comprising mainly a copper; and a surface-treated layer coextensive with an upper surface of the copper-based metal material and comprising an amorphous layer comprising oxygen and a metal with a higher oxygen affinity than the copper, the metal consisting of zinc, wherein the surface-treated layer has a thickness of not less than 8 nm and not more than 300 nm; and
a solar cell soldered by the soldering member.

9. A solder joint material, comprising
a copper-based metal material comprising mainly copper,
a surface-treated layer coextensive with an upper surface of the copper-based metal material and comprising an amorphous layer comprising the copper diffused from the copper-based metal material, a metal with a higher oxygen affinity than the copper, and oxygen, the metal consisting of zinc, and a Sn-based solder plating layer provided on the surface-treated layer.

10. The solder joint material according to claim 9 , wherein the solder joint material is plate-shaped, and wherein the solder joint material, further comprising:
another surface-treated layer coextensive with a lower surface of the copper-based metal material and comprising an amorphous layer the copper diffused from the copper-based metal material, a metal with a higher oxygen affinity than the copper, and oxygen, the metal consisting of zinc; and
another Sn-based solder plating layer provided on the other surface-treated layer of the copper-based metal material.

11. The solder joint material according to claim 9 , wherein the surface-treated layer further comprises a diffusion layer under the amorphous layer, and wherein the diffusion layer comprises copper and the metal with a higher oxygen affinity than the copper, or oxygen, copper and a metal with a higher oxygen affinity than the copper.

12. The solder joint material according to claim 9 , wherein the surface-treated layer has a thickness of not less than 8 nm and not more than 300 nm.

13. A solar cell module, comprising the solder joint material according to claim 9 ; and a solar cell soldered by using the solder joint material.

Assignees

• Hitachi Metals Ltd

Inventors

• Sagawa Hideyuki
• Fujito Keisuke
• Tsuji Takayuki
• Kuroda Hiromitsu

Classifications

• B23K35/26

  with the principal constituent melting at less than 400°C · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• H01L31/022425 Primary

  Electricity · mapped topic

• C23C10/28

  using solids, e.g. powders, pastes · CPC title

• B23K35/3602

  Carbonates, basic oxides or hydroxides · CPC title