Chucking warped wafer with bellows

Patent metadata

Field	Value
Publication number	US-9960070-B2
Application number	US-201514683555-A
Country	US
Kind code	B2
Filing date	Apr 10, 2015
Priority date	Dec 6, 2014
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A vacuum chuck has at least one suction assembly that pulls a wafer surface toward a chucking surface. The suction assembly may be used with a wafer that is warped. A suction force engages a pad of a suction assembly with the wafer surface and retracts a bellows of the suction assembly. As the bellows retracts and draws the wafer surface closer to the chucking surface, the suction force provided by the vacuum chuck can pull the wafer flat.

First claim

What is claimed is:

1. A vacuum chuck comprising:
a body defining a chucking surface and having a suction assembly opening defined by the chucking surface;
a suction assembly disposed in the suction assembly opening, wherein the suction assembly comprises:
a base;
a bellows having a first end and a second end opposite the first end, wherein the second end of the bellows is disposed on the base;
a pad having a first surface and a second surface opposite the first surface, wherein the second surface of the pad is disposed on the first end of the bellows, wherein the first surface defines a recess in the pad, the pad further comprising at least one channel between the first surface and second surface, the channel being defined by a channel wall;
a vacuum port in fluid communication with a first volume and a second volume, wherein the first volume is defined by the base, the bellows, and the pad, and wherein the second volume is defined partly by the recess; and
a spring inside the bellows disposed between the base and the pad;

wherein the first surface of the pad is a distance from the chucking surface in a first position and the first surface of the pad is more proximate the chucking surface in a second position than in the first position.

2. The vacuum chuck of claim 1 , further comprising a plurality of the suction assembly openings and a plurality of the suction assemblies disposed in the suction assembly openings.

3. The vacuum chuck of claim 1 , further comprising a floating part disposed between the bellows and the pad, wherein the floating part includes a floating part channel through a floating part body of the floating part defined by a floating part channel wall, wherein the floating part channel is in fluid communication with the channel of the pad, and wherein the first volume is further defined by the floating part.

4. The vacuum chuck of claim 1 , wherein the pad is fabricated of a polyimide.

5. The vacuum chuck of claim 1 , wherein the bellows is fabricated of stainless steel.

6. The vacuum chuck of claim 1 , further comprising a stop screw disposed in the base, wherein the stop screw is adjustable and wherein the stop screw is configured to provide a stop for the pad when the bellows retracts to the second position.

7. The vacuum chuck of claim 1 , wherein the first surface of the pad is flush with the chucking surface in the second position.

8. The vacuum chuck of claim 1 , wherein a cross-sectional area of the bellows is greater than a cross-sectional area of the pad.

9. The vacuum chuck of claim 8 , wherein a ratio of the cross-sectional area of the bellows to the cross-sectional area of the pad is from 1.1:1 to 1.5:1.

Assignees

• Kla Tencor Corp

Inventors

• Huang Luping

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• B25B11/005

  Vacuum work holders · CPC title

• F16J3/047

  Metallic bellows · CPC title

• H01L21/68785

  Electricity · mapped topic