Bowl-shaped structure, method for manufacturing same, and bowl array

Patent metadata

Field	Value
Publication number	US-9956740-B2
Application number	US-201214111468-A
Country	US
Kind code	B2
Filing date	Apr 10, 2012
Priority date	Apr 11, 2011
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

The present invention provides a method for manufacturing a bowl-shaped structure, a bowl-shaped structure manufactured thereby, and a bowl array using the bowl-shaped structure, wherein the method for manufacturing the bowl-shaped structure comprises the following steps: putting into contact a first substrate, on which a particle alignment layer is formed, and a second substrate so as to transfer the particle alignment layer to the second substrate; forming a particle-thin film complex by coating the particle alignment layer that is transferred on the second substrate with a thin film formation substance; removing a portion of the thin film formation substance from the complex to expose particles, and then removing the exposed particles to form a template having a hole; and forming the bowl-shaped structure by coating a first substance on the surface of the hole of the template and then removing the template.

First claim

What is claimed is:

1. A preparing method of bowl-typed structures, comprising:
forming an alignment layer of particles on a first substrate by applying physical pressure on the particles, so that the particles align with a regularly spaced distance from each other;
contacting the alignment layer of particles formed on the first substrate with a second substrate having an adhesive layer formed thereon to transfer the alignment layer of the particles aligned with a regularly spaced distance from each other to the second substrate by adhesion of the adhesive layer;
coating the alignment layer of the particles transferred onto the second substrate having the adhesive layer with a film-forming material so as to fill a space defining the regularly spaced distance between the particles to form a particle film composite;
removing the entire adhesive layer and a portion of the film-forming material from the particle film composite to expose the particles and then removing the exposed particles to form a template including holes that are separated by the regularly spaced distance; and
coating the surface of the holes of the template with a first material and then removing the template to form the bowl-typed structures that are separated by the regularly spaced distance.

2. The preparing method of bowl-typed structures of claim 1 ,
wherein the first material includes a member selected from the group consisting of a metal, a semiconductor, a metal oxide, an alloy, and combinations thereof.

3. The preparing method of bowl-typed structures of claim 1 ,
wherein the coating of the surface of the holes of the template with the first material is performed by sputtering, thermal evaporation, pulsed laser deposition, atomic layer deposition, ion-assisted deposition, or self-assembly.

4. The preparing method of bowl-typed structures of claim 1 , further including:
coating a second material once or more on the first material coated to the surface of the holes.

5. The preparing method of bowl-typed structures of claim 4 ,
wherein the second material includes a member selected from the group consisting of a metal, a semiconductor, a metal oxide, an alloy, and combinations thereof.

6. The preparing method of bowl-typed structures of claim 1 ,
wherein the first substrate includes a first intaglio pattern or a first embossed pattern.

7. The preparing method of bowl-typed structures of claim 1 ,
wherein the template has a porous film structure including regularly aligned holes.

8. The preparing method of bowl-typed structures of claim 1 ,
wherein a size of the particles is from 10 nm to 100 μm.

9. The preparing method of bowl-typed structures of claim 1 ,
wherein a thickness of a coating layer formed by the coating with the first material is from 1 nm to 10 μm.

10. The preparing method of bowl-typed structures of claim 1 ,
wherein the physical pressure is applied by rubbing or pressing against the substrate.

11. The preparing method of bowl-typed structures of claim 1 ,
wherein the particles include a member selected from an organic polymer, an inorganic polymer, an inorganic compound, a metal, a magnetic substance, a semiconductor, a biomaterial, and combinations thereof.

12. The preparing method of bowl-typed structures of claim 1 ,
wherein an aspect ratio which represents the ratio of a diameter and a depth of the bowl-typed structures is from 0.1 to 10.

13. The preparing method of bowl-typed structures of claim 1 ,
wherein the plurality of the bowl-typed structures are regularly aligned with a constant interval.

14. The preparing method of bowl-typed structures of claim 1 , further including:
transferring the formed bowl-typed structures onto a porous substrate.

Assignees

• Yoon Kyung Byung
• Kim Hyun Sung
• Univ Sogang Res Foundation

Inventors

• Yoon Kyung Byung
• Kim Hyun Sung

Classifications

• B81C1/00103 Primary

  Structures having a predefined profile, e.g. sloped or rounded grooves · CPC title

• Y10T428/13

  Hollow or container type article [e.g., tube, vase, etc.] · CPC title

• B32B3/30 Primary

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• C23C14/083

  of refractory metals or yttrium · CPC title

• C23C14/22

  characterised by the process of coating · CPC title