Process sheet resistance uniformity improvement using multiple melt laser exposures

US9953851B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9953851-B2
Application numberUS-201615207226-A
CountryUS
Kind codeB2
Filing dateJul 11, 2016
Priority dateMar 11, 2013
Publication dateApr 24, 2018
Grant dateApr 24, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermal processing apparatus, comprising: a laser source; a controller; a motor coupled to the controller; and an aperture member disposed at a focal plane of energy emitted from the laser source, wherein the aperture member is coupled to the motor, the aperture member comprising: a transmissive portion which is substantially transparent to the energy emitted from the laser source; and a non-transmissive portion which is substantially non-transmissive to the energy emitted from the laser source and is disposed with the transmissive portion substantially at the focal plane, wherein the non-transmissive portion is disposed between opposite sides of the transmissive portion along the optical axis. 2. The apparatus of claim 1 , wherein the transmissive portion has an opening that is substantially coplanar with the non-transmissive portion. 3. The apparatus of claim 2 , wherein the opening has a volume defined by the transmissive portion and the non-transmissive portion. 4. The apparatus of claim 1 , wherein the transmissive portion comprises a quartz or glass material. 5. The apparatus of claim 1 , wherein the non-transmissive portion is formed from an opaque material or a reflective material. 6. The apparatus of claim 5 , wherein the non-transmissive portion is formed from a reflective metallic material. 7. The apparatus of claim 5 , wherein the non-transmissive portion is a dielectric mirror. 8. The apparatus of claim 5 , wherein an interior surface of the non-transmissive portion is angled. 9. The apparatus of claim 1 , further comprising: a side member disposed radially outward of the transmissive portion and the non-transmissive portion. 10. The apparatus of claim 9 , wherein the transmissive portion, the non-transmissive portion, and the side member are coupled by a substantially transparent adhesive. 11. The apparatus of claim 10 , wherein the substantially transparent adhesive is Canada balsam. 12. The apparatus of claim 1 , wherein the aperture member is moveable relative to the focal plane. 13. The apparatus of claim 9 , wherein the side member is an adhesive material. 14. The apparatus of claim 13 , wherein the adhesive material is impermeable to gas. 15. A thermal processing apparatus, comprising: a laser source; a controller; a motor coupled to the controller; and an aperture member coupled to the motor, the aperture member moveably disposed at a focal plane of energy emitted from the laser source, the aperture member comprising: a transmissive portion having a first portion and a second portion, both of which are substantially transparent to the energy emitted from the laser source, the transmissive portion defining a volume between the first and second portions at the focal plane; a non-transmissive portion which is substantially non-transmissive to the energy emitted from the laser source and is disposed between the first portion and the second portion substantially at the focal plane; and a side member disposed radially outward of the transmissive portion and the non-transmissive portion, wherein the non-transmissive portion is disposed between opposite sides of the transmissive portion along the optical axis. 16. A thermal processing apparatus, comprising: a laser source; a controller; a motor coupled to the controller; and an aperture member coupled to the motor, the aperture member disposed at a focal plane of energy emitted from the laser source, the aperture member comprising: a transmissive portion which is substantially transparent to the energy emitted from the laser source, the transmissive portion comprising a single portion having an annular shelf formed therein; a non-transmissive portion which is substantially non-transmissive to the energy emitted from the laser source and is disposed within the annular shelf substantially at the focal plane; and a side member coupled to the transmissive portion and the non-transmissive portion, wherein the non-transmissive portion is disposed between opposite sides of the transmissive portion along the optical axis. 17. The apparatus of claim 16 , wherein the transmissive portion comprises a quartz or glass material. 18. The apparatus of claim 1 , wherein the non-transmissive portion is formed from an opaque material or a reflective material.

Assignees

Inventors

Classifications

  • Thermal treatments, e.g. annealing or sintering · CPC title

  • H10P34/42Primary

    with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

  • mainly by radiation · CPC title

  • Observing the temperature of the workpiece · CPC title

  • by using masks · CPC title

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Frequently asked questions

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What does patent US9953851B2 cover?
Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P34/42. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 24 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).