Nickel repair of titanium surfaces
US-9193012-B1 · Nov 24, 2015 · US
US9297078B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9297078-B2 |
| Application number | US-201314391296-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 2, 2013 |
| Priority date | Apr 10, 2012 |
| Publication date | Mar 29, 2016 |
| Grant date | Mar 29, 2016 |
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Official abstract text for this publication.
An object of the present invention is to obtain a hard disk substrate that can have a smooth surface of a plating film through electroless NiP plating and does not have deteriorated corrosion resistance against acid solutions. A method for producing a hard disk substrate of the present invention is a method for producing a hard disk substrate with an electroless NiP plating film, the method including immersing a substrate in a first electroless NiP plating bath containing an additive with leveling action, thereby forming a lower layer of the electroless NiP plating film on a surface of the substrate, the lower layer having smaller average surface roughness than the surface; and immersing the substrate that has the lower layer of the electroless NiP plating film formed thereon through the first plating step in a second electroless NiP plating bath, thereby forming an upper layer of the electroless NiP plating film, the upper layer having corrosion resistance against acid solutions and having a thickness of greater than or equal to 4 μm.
Opening claim text (preview).
The invention claimed is: 1. A method for producing a hard disk substrate with an electroless NiP plating film, comprising: a first plating step of immersing a substrate in a first electroless NiP plating bath containing an additive with leveling action, thereby forming a lower layer of the electroless NiP plating film on a surface of the substrate, wherein the additive is an organosulfur compound, the lower layer having smaller average surface roughness than the surface; and a second plating step of immersing the substrate that has the lower layer of the electroless NiP plating film formed thereon through the first plating step in a second electroless NiP plating bath, thereby forming an upper layer of the electroless NiP plating film directly on the lower layer, the upper layer having corrosion resistance against acid solutions and having a thickness of greater than or equal to 4 μm.
Two or more layers only obtained by electroless plating · CPC title
using hypophosphites · CPC title
Physics · mapped topic
with use of organic or inorganic compounds other than metals, first · CPC title
Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title
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