Resin composite electrolytic copper foil, copper clad laminate and printed wiring board
US-9949371-B2 · Apr 17, 2018 · US
This page is not indexed by search engines while we improve data quality.
Nagata Eiji patents
Nagata Eiji is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nagata Eiji |
| Total patents | 2 |
| First publication | Dec 8, 2016 |
| Latest publication | Apr 17, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Gas Chemical Co | 2 |
| Pi R&D Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/0346 | 2 |
| H05K3/384 | 2 |
| H05K2201/0358 | 2 |
| H05K1/09 | 2 |
| C25D5/022 | 2 |