Magnetoresistive stack and method of fabricating same

US9947865B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9947865-B2
Application numberUS-201715400889-A
CountryUS
Kind codeB2
Filing dateJan 6, 2017
Priority dateJun 10, 2011
Publication dateApr 17, 2018
Grant dateApr 17, 2018

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A magnetoresistive element (e.g., a spin-torque magnetoresistive memory element) includes a fixed magnetic layer, a free magnetic layer, having a high-iron alloy interface region located along a surface of the free magnetic layer, wherein the high-iron alloy interface region has at least 50% iron by atomic composition, and a first dielectric, disposed between the fixed magnetic layer and the free magnetic layer. The magnetoresistive element further includes a second dielectric, having a first surface that is in contact with the surface of the free magnetic layer, and an electrode, disposed between the second dielectric and a conductor. The electrode includes: (i) a non-ferromagnetic portion having a surface that is in contact with a second surface of the second dielectric, and (ii) a second portion having at least one ferromagnetic material disposed between the non-ferromagnetic portion of the electrode and the conductor.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a magnetoresistive stack on a substrate, the method comprising: forming a first dielectric layer over the substrate; forming a free magnetic layer over the first dielectric layer, wherein a first surface of the free magnetic layer is in contact with the first dielectric layer, wherein forming the free magnetic layer includes: depositing a first layer of iron over the first dielectric layer, after depositing the first layer of iron, depositing a first layer of a ferromagnetic material on the first layer of iron, after depositing the first layer of ferromagnetic material, depositing a non-ferromagnetic transition metal on the first layer of ferromagnetic material, after depositing the non-ferromagnetic transition metal, depositing a second layer of a ferromagnetic material on the non-ferromagnetic transition metal, and after depositing the second layer of ferromagnetic material, depositing a second layer of iron over the second layer of a ferromagnetic material; forming a second dielectric layer on a second surface of the free magnetic layer; and annealing the free magnetic layer, wherein, after annealing, the non-ferromagnetic transition metal does not break direct exchange coupling between the first layer of a ferromagnetic material and the second layer of a ferromagnetic material. 2. The method of manufacturing of claim 1 , further including forming a high-iron alloy interface region at the second surface of the free magnetic layer by annealing the second layer of iron of the free magnetic layer, wherein the high-iron alloy interface region has at least 50% iron by atomic composition. 3. The method of manufacturing of claim 1 , wherein the second layer of iron is deposited on the second layer of the ferromagnetic material and the method further includes: forming a first high-iron alloy interface region at the second surface of the free magnetic layer, wherein the first high-iron alloy interface region is in contact with the second dielectric layer and has at least 50% iron by atomic composition and includes materials from (i) the second layer of iron and (ii) the second layer of a ferromagnetic material. 4. The method of manufacturing of claim 3 , further including forming a second high-iron alloy interface region at the first surface of the free magnetic layer, wherein the first high-iron alloy interface region is in contact with the first dielectric layer and has at least 50% iron by atomic composition and includes materials from (i) the first layer of iron and (ii) the first layer of a ferromagnetic material. 5. The method of manufacturing of claim 1 , wherein depositing the second layer of iron includes depositing iron having a thickness in the range of 1.5 Angstroms to 3 Angstroms. 6. The method of manufacturing of claim 5 , wherein depositing the second layer of iron includes depositing pure iron, and the method of manufacturing further includes: forming a high-iron alloy interface region at the second surface of the free magnetic layer from the second layer of iron wherein the high-iron alloy interface region is in contact with the second dielectric layer and includes at least 50% iron by atomic composition. 7. The method of manufacturing of claim 1 , wherein: depositing the first and second layers of ferromagnetic material each include depositing cobalt and iron, and depositing a non-ferromagnetic transition metal includes depositing tantalum, titanium, molybdenum, niobium, vanadium, zirconium, hafnium, chromium, manganese or tungsten. 8. The method of manufacturing of claim 1 , wherein: depositing the first and second layers of ferromagnetic material each include depositing cobalt and iron, and depositing a non-ferromagnetic transition metal includes depositing niobium, zirconium, tungsten or molybdenum. 9. A method of manufacturing a magnetoresistive stack on a substrate, the method comprising: forming a first dielectric layer over the substrate; forming a second dielectric layer over the substrate; forming a free magnetic layer between the first and second dielectric layers, wherein a first surface of the free magnetic layer is in contact with the first dielectric layer and a second surface of the free magnetic layer is in contact with the second dielectric layer, wherein forming the free magnetic layer includes: depositing a first layer of a ferromagnetic material over the first dielectric layer, wherein the first layer of ferromagnetic material is an alloy including cobalt and iron, after depositing the first layer of a ferromagnetic material, depositing a non-ferromagnetic transition metal on the first layer of ferromagnetic material, after depositing the non-ferromagnetic transition metal, depositing a second layer of a ferromagnetic material on the non-ferromagnetic transition metal, wherein the second layer of ferromagnetic material is an alloy including cobalt and iron, and after depositing the second layer of a ferromagnetic material, forming a high-iron alloy interface region on or over the second layer of the ferromagnetic material and at the second surface of the free magnetic layer, the high-iron alloy interface region includes at least 50% iron by atomic composition; and annealing the free magnetic layer, wherein, after annealing, the non-ferromagnetic transition metal does not break direct exchange coupling between the first layer of a ferromagnetic material and the second layer of a ferromagnetic material. 10. The method of manufacturing of claim 9 , wherein forming the high-iron alloy interface region includes depositing a layer of iron on the second layer of the ferromagnetic material. 11. The method of manufacturing of claim 10 , wherein depositing the layer of iron includes depositing pure iron having a thickness in the range of 1.5 Angstroms to 3 Angstroms. 12. The method of manufacturing of claim 10 , wherein depositing the layer of iron includes depositing iron having a thickness that is less than 5 angstroms. 13. The method of manufacturing of claim 12 , wherein depositing a non-ferromagnetic transition metal includes depositing niobium, zirconium, tungsten or molybdenum. 14. The method of manufacturing of claim 9 , wherein depositing a non-ferromagnetic transition metal includes depositing tantalum, titanium, molybdenum, niobium, vanadium, zirconium, hafnium, chromium, manganese or tungsten. 15. The method of manufacturing of claim 9 , wherein depositing a non-ferromagnetic transition metal includes depositing niobium, zirconium, tungsten or molybdenum. 16. The method of manufacturing of claim 9 , wherein forming a high-iron alloy interface region on or over the second layer of the ferromagnetic material and at the second surface of the free magnetic layer further includes: depositing a layer of iron on or over the second layer of the ferromagnetic material, and annealing the layer of iron of the free magnetic layer to form a high-iron alloy including (i) at least 50% iron by atomic composition, (ii) at least one ferromagnetic material from the second layer of the ferromagnetic material, and (iii) iron from the layer of iron. 17. A method of manufacturing a magnetoresistive stack on a substrate, the method comprising: forming a first dielectric layer over the substrate; forming a second dielectric layer over the substrate; and forming a free magnetic layer between the first and second dielectric layers, wherein a first surface of the free magnetic layer is in contact with the first dielectric layer and a second surface of the free magnetic layer is in contact w

Assignees

Inventors

Classifications

  • G11C11/161Primary

    details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell · CPC title

  • Electricity · mapped topic

  • H01L43/12Primary

    Electricity · mapped topic

  • Electricity · mapped topic

  • Electricity · mapped topic

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What does patent US9947865B2 cover?
A magnetoresistive element (e.g., a spin-torque magnetoresistive memory element) includes a fixed magnetic layer, a free magnetic layer, having a high-iron alloy interface region located along a surface of the free magnetic layer, wherein the high-iron alloy interface region has at least 50% iron by atomic composition, and a first dielectric, disposed between the fixed magnetic layer and the fr…
Who is the assignee on this patent?
Everspin Technologies Inc
What technology area does this patent fall under?
Primary CPC classification G11C11/161. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).