Micro-electro-mechanical system (MEMS) structures and design structures

Patent metadata

Field	Value
Publication number	US-9938137-B2
Application number	US-201615162997-A
Country	US
Kind code	B2
Filing date	May 24, 2016
Priority date	Apr 12, 2013
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.

First claim

What is claimed:

1. A method comprising forming a Micro-Electro-Mechanical System (MEMS) beam structure by:
forming both tungsten material and semiconductor material on a substrate;
forming the MEMS beam structure above the tungsten material and the semiconductor material;
forming both the tungsten material and the semiconductor material above the MEMS beam structure;
forming a lid over the tungsten material and the semiconductor material formed above the MEMS beam structure, and
venting, using an XeF 2 etchant, both tungsten material and semiconductor material at least above and below the MEMS beam structure to form an upper cavity structure below the lid and above the MEMS beam structure and a lower cavity structure above the substrate and below the MEMS beam structure,
wherein the MEMS beam structure comprises a cantilevered beam structure, and
wherein the tungsten material above the MEMS beam structure is formed in seams formed in the semiconductor material above the MEMS beam, and the venting begins with the semiconductor material above the MEMS beam structure.

2. The method of claim 1 , wherein the venting and film thicknesses are controlled to ensure that all or substantially all of the tungsten material above the MEMS beam structure is removed, prior to the semiconductor material above the MEMS beam structure.

3. The method of claim 1 , wherein the semiconductor material is one of silicon material and germanium material.

4. The method of claim 3 , wherein the semiconductor material is silicon material, and wherein the tungsten material and silicon material below the MEMS beam structure comprises forming the tungsten material on a substrate and forming the silicon material over the tungsten material.

5. The method of claim 4 , wherein the tungsten material and silicon material above the MEMS beam structure comprises forming the silicon material within a via in contact with the silicon material below the MEMS beam structure and forming the tungsten material over the silicon material.

6. The method of claim 5 , wherein the venting comprising forming a vent hole in the lid to expose at least the silicon material above the MEMS beam structure.

7. The method of claim 6 , wherein the tungsten material at least one of above and below the MEMS beam structure is formed by a physical vapor deposition process followed by a chemical vapor deposition process.

8. The method of claim 6 , further comprising forming an additional silicon material on the tungsten material above the MEMS beam structure.

9. The method of claim 8 , further comprising:
planarizing the additional silicon material;
forming the lid over the planarized additional silicon material;
forming at least one venting hole in the lid, exposing the additional silicon material; and
venting the tungsten material, silicon material and additional silicon material above and below the MEMS beam structure to form the upper cavity and the lower cavity.

10. The method of claim 1 , wherein the venting forms an undercut in at least one of the upper cavity and the lower cavity.

11. The method of claim 1 , wherein the tungsten material at least one of above and below the MEMS beam structure is devoid of oxide.

12. The method of claim 1 , further comprising forming an additional silicon material on the tungsten material above the MEMS beam structure.

13. The method of claim 12 , further comprising cleaning an exposed surface of the additional silicon material prior to venting the tungsten material, silicon material and additional silicon material.

14. The method of claim 13 , wherein the cleaning is performed with an HF solution.

15. The method of claim 1 , wherein, after venting, a vent hole in the lid is sealed.

16. The method of claim 15 , wherein the vent hole is sealed with at least one of a dielectric and a metal.

17. The method of claim 16 , wherein, after the vent hole is sealed, a hermetic sealing layer is provided over the sealed vent hole.

18. The method of claim 17 , wherein the hermetic sealing layer is comprised of at least one of a silicon oxide and a silicon nitride.

Assignees

• IBM

Inventors

• Brigham Michael T
• Jahnes Christopher V
• Luce Cameron E
• Maling Jeffrey C
• Murphy William J
• Stamper Anthony K
• White Eric J

Classifications

• B81C2201/0104

  Chemical-mechanical polishing [CMP] · CPC title

• B81B2207/09

  Packages · CPC title

• B81B2203/0315

  Cavities · CPC title

• B81C2201/0125

  Blanket removal, e.g. polishing · CPC title

• B81C1/00365

  having low tensile stress between layers · CPC title