Microfluid delivery device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9469109-B2
Application number	US-201414531830-A
Country	US
Kind code	B2
Filing date	Nov 3, 2014
Priority date	Nov 3, 2014
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

Embodiments disclose herein are directed to a microfluidic delivery device that has a predominantly semiconductor structure, such as silicon. In particular, the structure for delivering fluid may be formed from polycrystalline silicon, also called polysilicon, or epitaxial silicon. The microfluidic delivery device that predominantly uses silicon based materials to form the structures that are in contact with the dispensed fluid results in a device that is compatible with a wide set of fluids and applications.

First claim

The invention claimed is:

1. A microfluidic device comprising:
a nozzle plate including a dielectric layer, a substrate layer, and a nozzle;
a chamber body, the chamber body including a semiconductor substrate, a dielectric layer over the semiconductor substrate, and a semiconductor layer over the dielectric layer, the semiconductor layer being a layer of epitaxial polysilicon and the semiconductor substrate being a silicon substrate;
a chamber at least partially formed in the semiconductor layer and covered by the nozzle plate, the chamber in fluid communication with the nozzle; and
a fluid inlet comprising an aperture through the chamber body and in fluid communication with the chamber.

2. The microfluidic device of claim 1 wherein:
the chamber is formed by a top, a bottom, and sidewalls;
the top of the chamber is formed by a surface of the dielectric layer of nozzle plate, the bottom of the chamber is formed by a surface of the chamber dielectric layer; and
at least a portion of the sidewalls is formed by a portion of the semiconductor layer.

3. The microfluidic device of claim 1 wherein the dielectric layer of the nozzle plate and the dielectric layer of the chamber body include silicon dioxide.

4. The microfluidic device of claim 1 wherein the dielectric layer of the chamber body includes a lower dialectic layer and an upper dielectric layer, and a buried silicon runner therebetween, the buried silicon runner including a heating portion and an interconnection portion.

5. The microfluidic device of claim 4 wherein the heating portion is a polysilicon material and the interconnection portion is a silicide material.

6. The microfluidic device of claim 1 , further comprising:
a bonding pad;
a heater; and
a trench in the chamber body that electrically isolates the boding pad from the chamber body.

7. The microfluidic device of claim 6 wherein the nozzle plate includes a pad access structure above the electrical bonding pad.

8. The microfluidic device of claim 1 further comprising:
a chamber body bonding ring formed on an upper surface of the semiconductor layer of the chamber body; and
a nozzle plate bonding ring formed on a lower surface of the dielectric layer of the nozzle plate, the chamber body bonding ring bonded to the nozzle plate bonding ring.

9. A microfluidic device comprising:
a nozzle plate including a dielectric layer, a substrate layer, and a nozzle, the dielectric layer located on a surface of the substrate layer;
a chamber body including a silicon substrate, a dielectric layer over the silicon substrate, and a silicon layer over the dielectric layer, the chamber body including an opening in the silicon layer, wherein the chamber body is coupled to the nozzle plate;
a chamber defined by the opening in the chamber body and the nozzle plate, the chamber being configured to hold a fluid; and
a fluid inlet delimited by an opening through the chamber body, the nozzle being in fluid communication with the fluid inlet through the chamber.

10. The microfluidic device of claim 9 , further comprising a heater component in the chamber body, the heater component configured to heat the fluid in the chamber to expel fluid through the nozzle.

11. The microfluidic device of claim 10 , wherein the heater component is facing the nozzle.

12. The microfluidic device of claim 9 , wherein the chamber body is coupled to the nozzle plate by metallic bonding pads.

13. A microfluidic device comprising:
a fluid reservoir having an interior configured to contain fluid; and
a microfluidic delivery device mechanically coupled to the fluid reservoir and including:
a nozzle plate including a nozzle having an opening extending through the nozzle plate;
a chamber body coupled to the nozzle plate, the chamber body including a semiconductor substrate, a dielectric layer over the semiconductor substrate, and an epitaxial silicon growth layer over the dielectric layer;
a chamber at least partially formed by a cavity formed in the epitaxial silicon growth layer and a surface of the nozzle plate, the chamber in fluid communication with the nozzle and in fluid communication with the fluid reservoir; and
a metal layer forming a ring around the fluid chamber and a fluid tight seal between the chamber body and the nozzle plate, the metal layer coupling the chamber body to the nozzle plate.

14. The microfluidic device of claim 13 wherein:
the chamber includes a top, a bottom, and sidewalls;
the chamber top is the surface of the nozzle plate, the bottom of the chamber is a surface of the dielectric layer of the chamber body; and
at least a portion of the epitaxial forming at least a portion of the sidewalls.

15. The microfluidic device of claim 14 , further comprising:
a bonding pad;
a heater; and
a trench in the chamber body that electrically isolates the boding pad from the portion of the sidewalls formed by the portion of the epitaxial forming at least the portion of the sidewalls.

16. The microfluidic device of claim 13 , further comprising a heater component in the chamber body, the heater component configured to heat the fluid in the chamber to expel fluid through the nozzle.

17. The microfluidic device of claim 16 , wherein the heater component is facing the nozzle.

18. The microfluidic device of claim 13 wherein the metal layer is gold.

19. A microfluidic device comprising:
a nozzle plate including a dielectric layer, a substrate layer, and a nozzle;
a chamber body, the chamber body including a semiconductor substrate, a dielectric layer over the semiconductor substrate, and a semiconductor layer over the dielectric layer;
a chamber at least partially formed in the semiconductor layer and covered by the nozzle plate, the chamber in fluid communication with the nozzle;
a fluid inlet comprising an aperture through the chamber body and in fluid communication with the chamber; and
a chamber body bonding ring formed on an upper surface of the semiconductor layer of the chamber body and a nozzle plate bonding ring formed on a lower surface of the dielectric layer of the nozzle plate, the chamber body bonding ring bonded to the nozzle plate bonding ring.

20. The microfluidic device of claim 19 wherein:
the chamber is formed by a top, a bottom, and sidewalls, the top of the chamber is formed by a surface of the dielectric layer of the nozzle plate, the bottom of the chamber is formed by a surface of the dielectric layer of the chamber body; and
at least a portion of the sidewalls include a portion of the semiconductor layer.

21. The microfluidic device of claim 19 wherein the dielectric layers of the nozzle plate and the chamber body includes silicon dioxide.

Assignees

• St Microelectronics Srl

Inventors

• Faralli Dino
• Castoldi Laura Maria
• Ferrari Paolo
• Carminati Marta

Classifications

• H10P50/287

  by chemical means · CPC title

• H10P14/2901

  Materials · CPC title

• H10P14/43

  Chemical deposition, e.g. chemical vapour deposition [CVD] · CPC title

• B41J2/162

  Manufacturing of the nozzle plates · CPC title

• B41J2/1626

  etching · CPC title