Power electronics arrangement and vehicle with said arrangement

Patent metadata

Field	Value
Publication number	US-9935032-B2
Application number	US-201715487519-A
Country	US
Kind code	B2
Filing date	Apr 14, 2017
Priority date	Apr 18, 2016
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.

First claim

What is claimed is:

1. A power electronics arrangement ( 1 ), with a power semiconductor module ( 3 ), with a contact spring ( 6 ), with a load-connecting element ( 7 ) and with a mounting device ( 8 ), wherein:
the power semiconductor module ( 3 ) has a load-connection element ( 34 ) and a first external contact face ( 340 );
the load connecting element ( 7 ) has a second contact face ( 740 );
a contact spring ( 6 ) enables an electrically conductive pressure contact connection between the first contact face ( 340 ) and the second contact face ( 740 ); and
wherein said power semiconductor module ( 3 ) is further frictionally connected to the mounting device ( 8 ) and provides a pressure force on the contact spring ( 6 ).

2. The power electronics arrangement according to claim 1 , wherein:
the electrically conductive pressure contact connection is a direct connection between the first contact face ( 340 ) and the second contact face ( 740 ).

3. The power electronics arrangement according to claim 1 , wherein:
the electrically conductive pressure contact connection is an indirect connection between the first contact face ( 340 ) and the second contact face ( 740 );
the contact spring ( 6 ) arranged between the first and second contact faces is electrically conductive;
further comprising:
a third contact face ( 640 ) of the contact spring ( 6 ) is in respectively direct electrical contact with the first contact face ( 340 ); and
a fourth contact face ( 642 ) of the contact spring ( 6 ) is in respectively direct electrical contact with the second contact face ( 740 ).

4. The power electronics arrangement, according to claim 1 , wherein:
the contact spring ( 6 ) is a helical spring.

5. The power electronics arrangement, according to claim 4 , wherein:
the mounting device ( 8 ) has a pin ( 84 ) which is composed of an electrically insulating material.

6. The power electronics arrangement, according to claim 5 , wherein:
the pin ( 84 ) extends into an interior ( 60 ) of the contact spring ( 6 ).

7. The power electronics arrangement, according to claim 4 , wherein:
wherein the pin ( 84 ) extends through a cutout ( 700 ) in the load-connecting element ( 7 ).

8. The power electronics arrangement, according to claim 4 , wherein:
the pin ( 84 ) extends into the interior of the load connection element ( 34 ); and
the load connection element ( 34 ) is partially a contact sleeve.

9. The power electronics arrangement, according to claim 1 , wherein:
the load connection element ( 34 ) projects outwardly therefrom and through a plastic housing ( 30 ) of the power semiconductor module ( 3 ).

10. The power electronics arrangement, according to one of claim 1 , wherein:
the load connection element ( 34 ) projects outwardly through a metallic baseplate ( 50 );
the baseplate ( 50 ) being a part of a cooling device ( 52 , 54 ) of the power semiconductor module ( 3 ); and
the load connection element ( 34 ) is electrically insulated with respect to the baseplate.

11. The power electronics arrangement, according to claim 1 : wherein:
the mounting device ( 8 ) and the power semiconductor module ( 3 ) are fixably joined by threaded connection.

12. An electrically driven vehicle ( 9 ) with a power electronics arrangement ( 1 ) according to claim 1 , further comprising:
an energy storage device ( 92 ) and with an electric drive motor ( 90 ) as a main drive or auxiliary drive.

13. The electrically driven vehicle according to claim 12 , wherein:
the mounting device ( 8 ) is an integral component of a drive axle.

14. The electrically driven vehicle according to claim 12 , wherein:
the energy storage device ( 92 ) and the drive motor ( 90 ) are electrically connected to the power semiconductor module ( 3 ) of the power electronics arrangement ( 1 ) by a plurality of the respective load connecting elements ( 7 ) and the assigned load connection elements.

15. The electrically driven vehicle according to claim 14 , wherein:
the vehicle ( 9 ) is an industrial truck.

Assignees

• Semikron Elektronik Gmbh & Co Kg

Inventors

• Frank Thomas
• Walter Christian
• Weiss Stefan
• Ziegler Thomas

Classifications

• H01R12/7047

  with a fastener through a screw hole in the coupling device · CPC title

• B60R16/03

  for supply of electrical power to vehicle subsystems {or for (circuit arrangements for charging batteries H02J7/00)} · CPC title

• H01R13/73

  Means for mounting coupling parts to apparatus or structures, e.g. to a wall · CPC title

• H01R2201/26

  for vehicles · CPC title

• B60K1/02

  comprising more than one electric motor · CPC title